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Miniature light emitting diode display chip and preparation method thereof

A technology of light-emitting diodes and display chips, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of high positioning accuracy and small size of Micro-LEDs, and achieve high yield, reduce removal thickness, and reduce process difficulty. Effect

Pending Publication Date: 2022-05-31
RAYSOLVE OPTOELECTRONICS (SUZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small size of Micro-LEDs and high positioning accuracy requirements, how to transfer Micro-LED chips to circuit substrates in batches with high efficiency and high yield has become a technical bottleneck that urgently needs breakthroughs in the application of Micro-LEDs to the field of micro-display technology.

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  • Miniature light emitting diode display chip and preparation method thereof
  • Miniature light emitting diode display chip and preparation method thereof
  • Miniature light emitting diode display chip and preparation method thereof

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of this specification with reference to the accompanying drawings in the embodiments of this specification. Obviously, the described embodiments are only some of the embodiments of this specification, not all of them. Based on the embodiments in this specification, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this specification.

[0023] The meaning of "on" in this specification should be interpreted in the broadest possible manner, such that "on" not only means "directly on something", but also includes "on something" of an intermediate component or layer.

[0024] The term "layer" used in this specification refers to a material portion including a region having a certain thickness. A layer may extend across the entire underlying or superstructure, or may have an extent that is less than th...

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Abstract

The embodiment of the invention provides a micro light-emitting diode display chip and a preparation method thereof. The micro light-emitting diode display chip comprises a first substrate, a second substrate and a plurality of light-emitting diodes, wherein the first substrate comprises a driving circuit and a plurality of first contacts electrically connected with the driving circuit; the LED semiconductor layer comprises a first doping type semiconductor layer, an active layer and a second doping type semiconductor layer which are stacked, and the LED semiconductor layer is divided into a plurality of LED units; the plurality of insulating parts are arranged on the first substrate, correspond to the first contacts and are provided with open holes for exposing the first contacts; the bonding layer is located between the first substrate and the LED semiconductor layer and comprises a bonding main body part electrically connected with the first doping type semiconductor layer and a bonding pad located in the opening, the insulating part enables the bonding pad to be insulated from the bonding main body part, and the second doping type semiconductor layer of the LED unit is electrically connected with the first contact through the bonding pad. The insulating part and the bonding pad are arranged in the open hole, so that the bonding pad is insulated from the bonding main body part, and the first contact is insulated from the bonding main body part, and the short circuit risk is reduced.

Description

technical field [0001] This specification relates to the field of display technology, in particular to a micro light-emitting diode display chip and a preparation method thereof. Background technique [0002] Light-emitting diodes (light-emitting diodes, LEDs), as a light-emitting device, are widely used in lighting, display and other fields. With the development of technology, micro light emitting diodes have been widely concerned. Micro light-emitting diodes make the traditional light-emitting diode structure thinner, miniaturized, and arrayed. The light-emitting devices formed by micro-light-emitting diodes have the advantages of high brightness, high pixel density, low power consumption, and long life. [0003] A micro-LED display has an array of micro-LEDs forming a single pixel element. A pixel is a tiny illuminated area on a display screen, and many pixels can make up an image. In other words, pixels can be the small discrete elements that together make up an image...

Claims

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Application Information

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IPC IPC(8): H01L27/15H01L33/62H01L33/00
CPCH01L27/156H01L33/62H01L33/0093
Inventor 仉旭庄永漳
Owner RAYSOLVE OPTOELECTRONICS (SUZHOU) CO LTD