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Manufacturing method of CIS glass cover

A manufacturing method and glass cover technology, applied in radiation control devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as complex procedures, photoresist residue, chip scrapping, etc., to reduce process difficulty and improve quality products rate effect

Pending Publication Date: 2022-06-03
苏州轩创科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the method of coating photoresist is used to make the glass cover, and the general process is as follows figure 2 As shown, there are a total of more than ten processes from photoresist coating to lamination, and the process is complicated. Poor development can easily lead to pattern deformation and affect the use effect. It is difficult to clean after development, and photoresist residues are likely to occur. Seriously cause this chip to be scrapped

Method used

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  • Manufacturing method of CIS glass cover
  • Manufacturing method of CIS glass cover

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] A manufacturing method of a CIS glass cover, such as figure 1 shown, including the following steps:

[0026] S1. Laser scanning: use a laser transmitter to emit a special laser (the laser is a femtosecond laser), and scan the graphic outline on the glass surface;

[0027] The laser transmitter is clamped by a mechanical arm, and the laser transmitter is driven by the mechanical arm to move, and the graphic outline is scanned...

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Abstract

The invention discloses a manufacturing method of a CIS glass cover, and relates to the field of CIS wafer processing, and the manufacturing method specifically comprises the following steps: S1, laser scanning: transmitting femtosecond laser by using a laser transmitter, and scanning a pattern contour on the surface of glass; s2, liquid medicine corrosion: liquid medicine is used for corroding a corresponding graph at the contour corrosion position; s3, glue filling: high-light-transmission glue is filled into the pattern corroded by the liquid medicine; s4, wafer attaching: attaching the wafer to the surface of the glass along the glue; according to the method, a laser process is used for replacing a traditional exposure and development process, the surface of the glass is scanned through laser, after the needed pattern is scanned, the surface of the pattern is corroded through the liquid medicine, then gluing and wafer attaching are conducted, the process difficulty is greatly reduced, and the yield is increased.

Description

Technical field [0001] The invention relates to the field of CIS wafer processing, specifically a method for making a CIS glass cover. Background technique [0002] Microelectronic imaging components are widely used in mobile devices. Image sensors are an important part of microelectronic imaging components. Image sensors are semiconductor devices that convert optical images into electrical signals. They can generally be divided into charge-coupled devices (CCD) and complementary devices. Metal oxide semiconductor image sensor chip (CMOS image sensor chip, CIS). [0003] The CIS chip uses a control circuit and a signal processing circuit located around the MOS transistor and uses the switching technology of the MOS transistor to sequentially detect the output. The number of MOS transistors is equal to the number of pixels, that is, it uses light to pass through the surface glass cover and light-transmitting glue to illuminate to the photosensitive area on the chip to comple...

Claims

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Application Information

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IPC IPC(8): H01L27/146C03C15/00C03C27/00
CPCH01L27/14683C03C15/00C03C27/00Y02P70/50
Inventor 周旭李居知李华
Owner 苏州轩创科技有限公司