Hybrid soft-rigid electrical interconnect system

An electrical interconnection, interconnection board technology, used in the field of hybrid multi-component electronic/electrical circuits and equipment, hybrid electrical interconnection systems, and can solve problems such as lack of excessive hardening

Pending Publication Date: 2022-06-03
ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] To date, to the best of the inventors' knowledge, a method that is seamless in terms of footprint, reliable, scala

Method used

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  • Hybrid soft-rigid electrical interconnect system
  • Hybrid soft-rigid electrical interconnect system
  • Hybrid soft-rigid electrical interconnect system

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[0046] The subject matter described below will be clarified by reference to the description of those aspects depicted in the drawings. However, it should be understood that the scope of protection of the present invention is not limited to those described below and those depicted in the drawings; Conversely, the scope of protection of the present invention is limited by the claims. Further, it should be understood that the particular conditions or parameters described below and / or shown are not limits on the scope of protection of the present invention, and the terms used herein are only for the purpose of describing specific aspects by way of example and are not intended to be restrictive.

[0047]Unless otherwise defined, the technical terms and scientific terms used herein have the same meaning as those of ordinary skill in the art to which the present invention belongs will normally be understood. In addition, unless otherwise required by context, singular terms should conta...

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Abstract

Disclosed is an electrical interconnect system comprising: i) an interconnect board comprising an intrinsically inelastic substrate having a first face and an opposing second face, and at least one conductive track on and/or within at least a portion of the substrate; ii) a stretchable interconnect comprising an intrinsically elastic substrate, the substrate comprising at least one recess or groove, the at least one recess or groove comprising at least one compliant conductive element therein, the at least one recess or groove being configured to receive the at least one conductive track of the interconnect plate; and iii) at least one conductive paste mass located within the at least one recess or groove configured to electrically connect the at least one compliant conductive element with the at least one conductive track.

Description

Technical field [0001] The present invention belongs to the field of electronic devices and electrical equipment. Specifically, the present invention relates to a hybrid (soft / rigid) electrical interconnect system, a method for producing it, and a low-profile (low-profile), hybrid (soft / rigid) multi-part electronic / electrical circuits and devices. Background [0002] In the field of wearables and implantable devices, soft and stretchable materials have been utilized to produce devices that can conform to complex static and dynamic 3D shapes. Specifically, in the field of implantable neural interfaces, it has recently been shown that rigid materials conventionally used as electronic substrates, although non-toxic, cause an inflammatory response when implanted due to mechanical mismatch between devices and soft host tissues. The use of conformable, soft and stretchable materials – closer to the target tissue in mechanical properties – can mitigate this side effect and allow s...

Claims

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Application Information

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IPC IPC(8): A61N1/375A61N1/36
CPCA61N1/3752A61N1/36125A61N1/3605A61N1/36014A61N1/05H05K3/363H05K1/0393H05K2201/0129H05K2201/0133H05K2201/0162H05K1/0283H05K2201/09909
Inventor F·法勒格G·斯基亚沃内S·P·拉库尔
Owner ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
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