Circuit board burr processing method and circuit board
A processing method and circuit board technology, applied in the directions of printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problems of incomplete removal of orifices, so as to improve processing efficiency and processing quality, and save production costs. , the effect of simple production methods
Pending Publication Date: 2022-06-07
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology
[0004] The purpose of the embodiments of the present application is to provide a circuit board draping treatment method and a circuit board to solve the technical problem of incomplete removal of the orifice edging in the prior art
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[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.
[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0034] It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicat...
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The invention provides a circuit board burr processing method. The circuit board burr processing method at least comprises the following steps of S10, providing a substrate; s20, drilling: drilling a through hole in the substrate; s30, copper reduction is carried out, and hole burrs of the through holes are removed; and S40, manufacturing the circuit board. According to the circuit board burr treatment method provided by the invention, after the copper reduction step is adjusted to the drilling step, the hole burrs can be thoroughly removed, the process parameters of a drilling machine do not need to be adjusted or a PET film and a pattern dry film do not need to be filled, the production cost can be saved, and the processing efficiency and the processing quality can be improved; the copper reduction process is adjusted from copper reduction before drilling to copper reduction after drilling, the production mode is simple and convenient, production is facilitated for production personnel, and the production efficiency is not affected.
Description
technical field [0001] The present application belongs to the technical field of circuit board processing, and more particularly, relates to a method and a circuit board for draping a circuit board. Background technique [0002] Rigid-flex board is a combination of soft board and hard board. It is a circuit board formed by combining a thin-layer flexible bottom layer and a rigid bottom layer, and then laminating them into a single component. At present, in the process of circuit board processing, it is necessary to drill holes on the circuit board. When the knife is returned after the drilling is completed, the drill will pull the end of the hole, resulting in the formation of an orifice at the end of the hole ( That is, burrs), especially in the concave area in the rigid-flex board, the height of the orifice drape is relatively large and difficult to remove; the orifice drape will have a greater adverse effect on the production of the outer layer line diagram in the subsequ...
Claims
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IPC IPC(8): H05K3/00H05K1/02H05K1/11
CPCH05K3/0047H05K1/02H05K1/115H05K2203/0346H05K2203/143
Inventor 高清宇廖俊发龙青武
Owner KINWONG ELECTRONICS TECH LONGCHUAN