GaN-based LED epitaxial structure capable of improving antistatic capability
An epitaxial structure, antistatic technology, applied in circuits, electrical components, semiconductor devices, etc., to achieve the effect of improving antistatic ability, uniform stress distribution, and reducing threading dislocations
Inactive Publication Date: 2022-06-10
HUAIAN AUCKSUN OPTOELECTRONICS TECHNOLOGY CO LTD
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Problems solved by technology
However, the lattice mismatch between low-temperature P and P-AlGaN heterojunction is relatively large, which leads to high threading dislocation density and uneven stress distribution in the growth of P-AlGaN, which leads to the antistatic ability of LED chips. insufficient
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Abstract
The invention discloses a GaN-based LED epitaxial structure capable of improving antistatic capability and a preparation method thereof, insertion layers are added between low-temperature pGaN layers and between pAlGaN layers, and the insertion layers are AlN layers; or, the insertion layer is an In < x > Al < 1-x > N layer, and 0 lt; xlt; 0.3 part; or the insertion layer is an AlN and In < x > Al < 1-x > N composite layer, 0 < lt >; xlt; and 0.3. According to the invention, the structure of the insertion layer is improved, and the heterojunction interface becomes smooth, so that the stress distribution of the P-AlGaN layer is uniform, the penetration dislocation is reduced, and the effect of improving the antistatic capability of the LED chip is further achieved.
Description
technical field [0001] The invention relates to the field of semiconductor lighting, in particular to a GaN-based LED epitaxial structure with improved antistatic capability. Background technique [0002] Light-emitting diodes have developed rapidly in recent years because of their advantages in energy saving, environmental protection, smart design, and long life. In particular, the success of III-V nitride semiconductor LED technology in the field of blue light has directly promoted the entry of LED lighting into thousands of households. The current mainstream GaN-based light-emitting diode chip structure is: a buffer layer grown sequentially from bottom to top on a patterned sapphire substrate, a non-doped GaN layer, a Si-doped n-type GaN layer, a stress release layer, a multi-quantum well layer, and a low-temperature pGaN layer, pAlGaN layer, p-type GaN layer doped with Mg. However, the lattice mismatch between low-temperature P and P-AlGaN heterojunction is relatively ...
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IPC IPC(8): H01L33/02H01L33/06H01L33/12H01L33/14H01L33/32H01L33/00
CPCH01L33/025H01L33/06H01L33/12H01L33/145H01L33/32H01L33/0075
Inventor 潘超杨辉徐东倪瑞
Owner HUAIAN AUCKSUN OPTOELECTRONICS TECHNOLOGY CO LTD



