High-temperature fast-curing low-stress epoxy resin composition and preparation method thereof
A technology of epoxy resin and composition, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device components, circuits, etc., and can solve the problems that epoxy molding compounds cannot completely achieve zero delamination and large stress
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[0113] The present invention also relates to a preparation method of the epoxy resin composition, which comprises the following steps:
[0114] (1) each component is weighed and mixed to obtain a premixed powder,
[0115] (2) heating and mixing the premixed powder and extruding, pulverizing to obtain a product,
[0116] and optionally
[0117] (3) the product is stored in a low temperature environment;
[0118] Wherein the temperature of the low temperature environment in step (3) is lower than 5°C.
[0119] Step (1) may also include grinding the components to a smaller size by grinding equipment, such as a ball mill.
[0120] The equipment for mixing in step (1) should allow the components to be mixed uniformly. In one embodiment, mixing is performed using a high speed mixer. The speed of mixing in step (1) is usually about 200-300 rpm. The mixing time is usually about 20-50 minutes, preferably about 30 minutes.
[0121] In step (1), the components can be added togethe...
Embodiment
[0135] The solution of the present invention will be further described in detail below in conjunction with specific embodiments.
[0136] It should be noted that the following examples are only examples for clearly illustrating the technical solutions of the present invention, rather than limiting the present invention. For those of ordinary skill in the art, other different forms of changes or changes can also be made on the basis of the above description, and it is not necessary and impossible to list all the implementations here, and it is obvious from the above. Changes or changes are still within the protection scope of the present invention. Instrumentation and reagent materials used herein are commercially available unless otherwise indicated.
[0137] Material
[0138] Epoxy:
[0139] Epoxy resin (EOCN), which has the following structure:
[0140] where n is 1, 2 or 3.
[0141] Polyaromatic epoxy resin (MAR), which has the following structure:
[0142] where ...
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Abstract
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