LED and semiconductor laser chip sorting machine control method and sorting machine

Abstract

The invention discloses an LED and semiconductor laser chip sorting machine control method and a sorting machine, and relates to the technical field of mechanical equipment control. The method comprises the steps that a silicon wafer lifting table moves, and a silicon wafer to be grabbed is conveyed to a silicon wafer mechanical arm grabbing position; the silicon wafer manipulator grabs the silicon wafer and places the silicon wafer on a silicon wafer workbench; the material sheet lifting bin moves to convey the material sheets to be grabbed to a material sheet manipulator grabbing position; the material sheet manipulator is used for grabbing the material sheet and placing the material sheet on the placing workbench; and the chip is sucked up by a suction nozzle of the suction and release device through recognition of a CCD camera, the suction nozzle of the suction and release device swings to a placement position to place the chip on the material sheet, meanwhile, the other suction nozzle swings to the suction position to suck the next chip, and the process is repeated until the chips of the same grade on the silicon wafer are all placed on the material sheet.

Description

technical field [0001] The invention relates to the technical field of mechanical equipment control, in particular to a control method for an LED and semiconductor laser chip sorting machine and a LED and semiconductor laser chip sorting machine. Background technique [0002] The scale of the LED and semiconductor laser industry is developing very rapidly, and the market potential is huge, but its development cannot be separated from the development of the LED and semiconductor laser equipment industry. And the LED and semiconductor laser industry has its particularity. Due to the production process, each LED and semiconductor laser chip is unique and has slightly different electronic and optical characteristics, which requires all LED and semiconductor laser chips. Laser chips are tested and sorted according to their unique characteristics. However, the sorting of LED and semiconductor laser chips is very difficult. The main reason is that the size of the chips is generall...

AI Technical Summary

Problems solved by technology

[0004] The first method is that the test sorting is done by the same equipment. The disadvantage of this method is that the sorting speed is very slow and the production capacity is low;

[0005] The second method is that the testing and sorting are completed by two devices. Although this method speeds up the sorting speed, it has low reliability, is prone to errors, and has poor sorting accuracy;

[0006] It can be seen that the sorting speed and sorting accuracy of LED and semiconductor laser chip production have become the bottleneck problem of LED and semiconductor laser chip production, restricting the development of LED and semiconductor laser chip industry

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