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Preparation method of TiAl system layered composite board

A layered composite material, layered composite technology, applied in metal layered products, chemical instruments and methods, lamination and other directions, can solve the problems of low room temperature plasticity, deterioration performance, low toughness, etc., to achieve good integrity and organization. Controllable uniformity and high density

Active Publication Date: 2022-07-05
CHONGQING SANHANG ADVANCED MATERIALS RES INST CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the characteristics of its own phase structure, TiAl intermetallic compounds have intrinsic brittleness, and the plasticity at room temperature is extremely low, about 1% to 3%. At the same time, their toughness is also extremely low, so how to improve the plasticity and toughness of TiAl intermetallic compounds It directly affects the successful application of TiAl-based intermetallic compound materials under high temperature and complex stress field conditions
In addition, TiAl-based intermetallic compound materials are very easy to oxidize during preparation or processing, and will generate other intermetallic compound phases, thereby changing the properties of the material and deteriorating its performance

Method used

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  • Preparation method of TiAl system layered composite board
  • Preparation method of TiAl system layered composite board
  • Preparation method of TiAl system layered composite board

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] The present invention provides a technical solution: a method for preparing a TiAl-based layered composite plate, comprising the following steps:

[0031] S1. Prepare materials, prepare high temperature TiAl alloy sheet and high temperature Ti 2 AlNb alloy sheet;

[0032] High temperature TiAl alloy is Ti-43Al-4Nb-1Mo-0.1B alloy, high temperature Ti 2 AlNb alloy is Ti-22Al-25Nb alloy, high temperature TiAl alloy sheet and hig...

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Abstract

The invention provides a TiAl system layered composite board preparation method, which comprises: preparing a high temperature TiAl alloy sheet and a high temperature Ti2AlNb alloy sheet, carrying out surface treatment, carrying out vacuum diffusion bonding, placing into a sheath assembly, carrying out high temperature rolling, removing the sheath, polishing, cleaning, and carrying out heat treatment after the multi-pass high temperature rolling is completed so as to obtain the TiAl system layered composite board. According to the preparation method, the high-temperature TiAl alloy thin plate and the Ti2AlNb alloy thin plate are subjected to metallurgical connection through vacuum diffusion connection, then machining is conducted according to design requirements, and the layered composite plate with the design size is obtained, the high-temperature TiAl alloy thin plate and the Ti2AlNb alloy thin plate are subjected to metallurgical connection through vacuum diffusion connection, and then the layered composite plate is prepared through high-temperature rolling. And finally, double regulation and control of a sheet structure and a reaction interface structure are achieved through a heat treatment process, process-structure-performance integration is achieved, and the TiAl system layered composite board prepared through the method is good in integrity, controllable in structure uniformity and high in density and can be used on skins of aerospace crafts with the high Mach number and other high-temperature board structures.

Description

technical field [0001] The invention belongs to the technical field of preparation methods of TiAl series composite plates, and in particular relates to a preparation method of TiAl series layered composite plates. Background technique [0002] TiAl intermetallic compounds have high specific strength, high specific rigidity, high specific modulus and good oxidation resistance, and at the same time they have excellent high temperature properties, such as high temperature strength, high temperature creep properties and so on. However, due to the characteristics of its own phase structure, TiAl-based intermetallic compounds are inherently brittle and have extremely low room temperature ductility, about 1% to 3%; at the same time, their toughness is also extremely low, so how to improve the plasticity and toughness of TiAl-based intermetallic compounds It directly affects the successful application of TiAl intermetallic compound materials under high temperature and complex stres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00B23K20/02C22F1/02C22F1/18C21D9/00C22C14/00B32B15/01B32B15/20B32B37/06B23K103/16
CPCB23P15/00B23K20/026C22F1/02C22F1/183C21D9/0081C22C14/00B32B15/016B32B15/20B32B37/06B23K2103/166Y02E60/50
Inventor 唐斌朱雷卫贝贝陈彪李金山
Owner CHONGQING SANHANG ADVANCED MATERIALS RES INST CO LTD
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