Method and system for detecting punching forming of lead frame plastic package integrated circuit

Abstract

The invention relates to the field of lead frame plastic package integrated circuits, and particularly discloses a method and a system for detecting punching forming of a lead frame plastic package integrated circuit. According to the method, a convolutional neural network model is adopted to extract high-dimensional features of an induction matrix from an array transmission type photoelectric sensor and a regression reflection type photoelectric sensor, and meanwhile, a Gaussian density map is adopted to fuse a first feature map and a second feature map; and further, gradually simplifying the three-dimensional Gaussian density map by using a Gaussian mixture model, and comprehensively training a convolutional neural network by using a density map simplification loss function value and a classification loss function value, thereby helping the convolutional neural model to learn consistent feature representation in high-dimensional features. Therefore, the abnormity can be better detected, so that the equipment is protected, and the yield of products is ensured.

Description

technical field [0001] The present application relates to the field of lead frame plastic-encapsulated integrated circuits, and more particularly, to a detection method and system for punching and forming of lead-frame plastic-encapsulated integrated circuits. Background technique [0002] After the integrated circuit is molded, the residual gate epoxy molding compound of the plastic body needs to be removed, and the pins are bent and formed to meet the mounting requirements of the circuit. In the production process of the subsequent process, the pins of the circuit and the lead frame need to be cut and separated, and the frame and the circuit are only connected by the rib part, which will make its strength very poor. The damage to the connecting ribs caused by factors may cause the colloid to fall off during the subsequent punching and molding process of the integrated circuit, resulting in product scrap and damage to related processing equipment. [0003] Correspondingly,...

AI Technical Summary

Problems solved by technology

In the production process of the subsequent process, the pins of the circuit and the lead frame need to be cut and separated, and the frame and the circuit are only connected by the ribs, which will make its strength very poor. In addition, the uncontrollable Factors that damage the connecting ribs may cause the colloid to fall off during the subsequent punching and molding process of the integrated circuit, resulting in product scrapping and damage to related processing equipment

[0003] Correspondingly, in the process of punching and forming the lead wires of the lead frame plastic-encapsulated integrated circuits, there will be abnormal phenomena such as the rupture of the plastic package and the breakage of the pins. In case of mold damage

However, in the current detection process, since the surface of the plastic package is not only detected, the detection is difficult and the accuracy is low. In order to better detect these abnormalities, to protect the equipment and ensure the yield of the product , looking forward to a detection method for die-cutting of lead frame plastic-encapsulated integrated circuits

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