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Laser soft soldering device for dense pin connector

A connector and soldering technology, which is applied in the field of laser coaxial soldering devices for dense pin connectors, can solve the problems of laser focus deviating from the central axis of the welding wire, uneven axial distribution of laser energy, burning pins or pin overheating, etc. , to achieve the effect of improving the phenomenon of burning pads, reducing the relatively high requirements for laser alignment, and preventing oxidation and blackening

Pending Publication Date: 2022-07-08
WUHAN BESKYS TECH CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] The laser soldering of dense pin connectors usually adopts laser paraxial wire feeding welding. Laser paraxial wire feeding welding usually adopts the method of paraxial wire feeding. The exit position forms an angle with the optical axis direction of the laser. For welding If there are complex obstacles around the disk, tin wire collisions are prone to occur, and in some occasions—such as when the pad needs to be prevented from oxidation, a side-axis protective gas delivery device is required, which makes the system complex and consumes a lot of gas. The effect is not ideal; on the one hand, for wire feeding welding, the straightness of the small solder wire, the length control of the laser melting tin wire and the control of the wire feeding speed are all important process parameters that affect the quality of the solder. Axial wire feeding welding requires relatively high positioning of the laser. If you are not careful, the laser focus will deviate from the central axis of the welding wire, which will cause the problem of pin burning or pin overheating, especially for soldering of dense connectors. Especially prominent; if the circular laser welding process with coaxial wire feeding is adopted, although it can solve the high alignment accuracy requirements between the laser and the welding wire caused by side-axis wire feeding, and avoid the phenomenon of burning stitches, but because the laser light source is basically a Gaussian distribution, the center The energy density is high, and the annular beam shaping device requires that the axial direction of the light source is strictly coaxial with the central axis of the pyramid of the shaping optical device. After the annular beam is shaped, the axial distribution of the laser energy on the annular section will be more uneven, and the local area is too high The energy density of the welding wire will still lead to the phenomenon of tin bursting of the welding wire; in addition, for laser soldering of dense pin connectors, due to the close distance between the stripped wire end and the insulating rubber, when laser focusing, optical path control, welding wire feeding and shaping, and wire shaping If there is a small problem in any one of the controls, there may be smoke and dust caused by burning rubber, which will cause the pins to be polluted and seriously affect the brazing effect.

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  • Laser soft soldering device for dense pin connector
  • Laser soft soldering device for dense pin connector
  • Laser soft soldering device for dense pin connector

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Embodiment Construction

[0056] The embodiments of the present invention are further described below with reference to the accompanying drawings, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as a limitation of the present invention, and any modifications, equivalent replacements, or Improvements and the like should all be included within the scope of the claims of the present invention, and those not described in detail in this technical solution are all known technologies.

[0057] see figure 1 to the attached Figure 11 , The present invention is a laser soldering device for dense pin connectors, comprising: an optical path mechanism, a CCD imaging mechanism, a wire ...

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Abstract

The invention designs a laser coaxial soft soldering device for a dense pin connector. The laser coaxial soft soldering device comprises a light path mechanism, a CCD imaging mechanism, a wire feeding mechanism and a welding wire distributing mechanism. The light path mechanism generates annular laser at the pin welding position, the CCD imaging mechanism is used for visually judging the actual position of a pin and guiding real-time position calibration, the wire feeding mechanism is used for feeding a welding wire in the protective gas atmosphere, and the welding wire distribution mechanism comprises a distributor, a stepped shaft, a straight movement shaft, a straight movement shaft guider, a supporting sleeve, a straight movement shaft and a stepped shaft driving motor. The distributor comprises a coaxial cylinder assembly which has a set number of turns and is sleeved together, and the welding wire distribution mechanism is used for fixing a connector, clamping a wire, bending wire heads in sequence, aligning the wire heads with pins and then positioning the wire heads, and then carrying out laser welding on the pins in sequence. The welding wire distributor sequentially feeds the wire heads clamped by the jig into a brazing area for welding; the device is simple in structure, the problem of obstacles in paraxial wire feeding welding is solved, laser alignment is accurate, and the welding yield and the working efficiency are improved.

Description

technical field [0001] The invention relates to a laser coaxial soft soldering device for dense pin connectors, which belongs to the technical field of laser welding. Background technique [0002] Laser soldering of dense pin connectors usually adopts laser range-axis wire feeding. Laser range-axis wire feeding usually adopts range-axis wire feeding. The exit position forms an angle with the direction of the optical axis of the laser. When there are complex obstacles around the disk, it is easy to collide with tin wires, and in some occasions, such as when the pads need to be protected from oxidation, a side-shaft protective gas delivery device is required, which makes the system structure complex, and the gas consumption is large. The effect is not ideal; on the one hand, for wire feeding welding, the straightness of the small solder wire, the length control of the laser melting tin wire and the wire feeding speed control are all important process parameters that affect the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/005B23K3/06B23K3/08
CPCB23K1/0056B23K3/063B23K3/08
Inventor 徐琦王浩邱浩波叶凯喻露吴灿
Owner WUHAN BESKYS TECH CO LTD
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