Lead bonding on-line monitoring method based on digital twinning technology

A wire bonding and twinning technology, applied in neural learning methods, electrical digital data processing, biological neural network models, etc., can solve the problem of few online detection parameters, difficulty in describing various constitutive relations, and inability to realize macroscopic real-time simulation and other issues to achieve real-time simulation, improve robustness, and reduce losses

Active Publication Date: 2022-07-12
WUHAN FINEMEMS
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Problems solved by technology

In the wire bonding process, there are few parameters that can be detected online, and the process involves elastic-plastic deformation, friction, phase transition and even chemical reaction of the material. It is extremely difficult to describe its various constitutive relations by conventional methods, and it cannot Realize real-time simulation of macro reality

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  • Lead bonding on-line monitoring method based on digital twinning technology
  • Lead bonding on-line monitoring method based on digital twinning technology
  • Lead bonding on-line monitoring method based on digital twinning technology

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Embodiment Construction

[0031] In order to make it easy to understand the technical means, creation features, work flow, use method, purpose and effect of the present invention, the present invention is further described below with reference to the accompanying drawings.

[0032] see figure 1 . In the existing bonding machine, the rivet 3 is usually driven by the driving device on the worktable to weld the metal leads to the pads 4. During this process, the gold wires and the pads can also be carried out by the transducer 5. heating. The purpose of the on-line monitoring method for wire bonding of the present invention is the on-line monitoring of the bonding process.

[0033] Please refer to figure 1 , Figure 8 and Figure 9 . In a preferred embodiment, the wire bonding online monitoring method of the present invention includes the following steps: S1, establishing a wire bonding simulation model and optimizing it; S2, establishing a wire bonding data model; S3, establishing a wire bonding V...

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Abstract

The invention discloses a wire bonding online monitoring method based on a digital twinning technology. The method comprises the steps of establishing and optimizing a simulation model of wire bonding, establishing a data model of wire bonding, and establishing a visual model of wire bonding. The digital twinborn model is formed by mutual coupling evolution of a simulation model, a data model and a visual model. According to the online monitoring method, real-time analogue simulation is carried out on the wire bonding process by establishing the digital twinborn model for wire bonding, the digital twinborn model can be used for receiving external environment parameters and operation parameters in real time, real-time simulation is carried out on the bonding process, and visual monitoring on the bonding process is realized in a virtual space; key material parameters, such as crystal phase distribution, dislocation, porosity, atomic diffusivity and the like, which influence the service life and reliability of the device are provided for operators, and are taken as reference bases for judgment and decision making, so that the product yield is improved, and the loss caused by the fact that material defects are not perceived in time is reduced.

Description

technical field [0001] The invention belongs to the field of electronic packaging wire bonding technology, in particular to an online monitoring method for wire bonding based on digital twin technology. Background technique [0002] Since its invention, wire bonding has become the most commonly used and widely used lead technology for connecting leads between chips in electronic packaging technology. The bonding effect and the influence of the process on the device will greatly affect the performance and reliability of the device. However, in the wire bonding process, there are few parameters that can be detected online. The process involves material elastic-plastic deformation, friction, phase transition and even chemical reactions. It is extremely difficult to describe various constitutive relations by conventional methods. Real-time simulation of macroscopic reality is realized. [0003] The emergence and rapid development of digital twin technology provides new ideas f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/3308G06F30/398G06N3/08
CPCG06F30/3308G06F30/398G06N3/08Y02P90/02
Inventor 王小平曹万熊波梁世豪陈明艳陈耀源陈列
Owner WUHAN FINEMEMS
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