Production system and method for reducing welding voidage of photovoltaic module chip

Abstract

The invention discloses a production system and method for reducing the welding void rate of a photovoltaic module chip, and relates to the technical field of chip production, the production system comprises a chip cleaning module, a void rate detection module, a production analysis module and a signal monitoring module; the chip cleaning module is used for cleaning the welded semiconductor chip; the voidage detection module is used for detecting the voidage on the back silver layer of the semiconductor chip before and after cleaning by adopting an X-ray instrument; the chip inspection module is used for judging whether the corresponding semiconductor chip is qualified or not according to the detected voidage detection data; the production analysis module is used for judging whether the corresponding chip welding module needs to be overhauled or not according to the qualification condition of the semiconductor chip, so that the chip welding precision is improved, the voidage of the chip is reduced, and the product percent of pass is improved; and the signal monitoring module is used for monitoring the correction signal and judging whether the current operator needs to be alternated or not so as to prevent the chip production from being influenced due to the poor state of the operator.

Description

technical field [0001] The invention relates to the technical field of chip production, in particular to a production system and method for reducing the soldering void rate of photovoltaic module chips. Background technique [0002] For the diced semiconductor chip, due to the influence of storage time, environment and other factors, the back silver layer of the semiconductor chip is oxidized and deteriorated to form a silver-containing compound; the compound is attached to the surface of the silver layer, which will affect the infiltration between the silver layer and the solder. , forming mounting holes of different sizes, because the existence of the holes will greatly reduce the heat dissipation capacity of the product, when the product is powered on, the heat energy will accumulate in the holes, resulting in an increase in thermal resistance; when the holes exceed a certain range, the heat energy will accumulate too much , it will affect the performance of the product, ...

AI Technical Summary

Problems solved by technology

[0002] For the diced semiconductor chip, due to the influence of factors such as storage time and environment, the back silver layer of the semiconductor chip is oxidized and deteriorated to form a silver-containing compound; this compound is attached to the surface of the silver layer, which will affect the infiltration between the silver layer and the solder. , forming chip-loading cavities of different sizes, because the existence of cavities will greatly reduce the heat dissipation capacity of the product. When the product is powered on, heat energy will accumulate in the cavities, resulting in an increase in thermal resistance; when the cavities exceed a certain range, the heat energy will accumulate too much , it will affect the performance of the product, and even cause the product to be burned in severe cases;

[0003] However, in the existing technology, there is a problem that it is impossible to monitor the voids generated in the chip production process. When the void rate of the chip production is too high, it is impossible to give early warning in order to repair and calibrate the welding equipment, resulting in a large number of defective products, thereby increasing the number of chips. Production cost; at the same time, it is impossible to reasonably allocate the corresponding dispatcher to rotate with the current operator according to the state deviation, so as to prevent the chip production from being affected by the poor state of the operator; for this reason, the present invention proposes a method to reduce the soldering void rate of the photovoltaic module chip production system and method

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