Vacuum heating device

Abstract

The invention discloses a vacuum heating device which comprises a sample chamber, a heating system and a vacuum pump used for vacuumizing the sample chamber, a placing position used for placing a sample is arranged in the sample chamber, a plurality of layers of oxygen absorption sources are arranged around the placing position, the oxygen absorption sources are connected through connecting pieces, and the connecting pieces are connected with the heating system. The connecting piece is detachably connected with the sample chamber, and the heating system is used for heating the sample and the oxygen absorption source respectively; the connecting piece is a connecting plate with a groove or a plurality of connecting blocks with through holes. According to the vacuum heating device disclosed by the invention, a plurality of layers of oxygen absorption sources are arranged around the sample placement position in the sample chamber, and the oxygen absorption sources react with free oxygen in a heating state, so that the oxidation of the sample in a high-temperature heat treatment process is slowed down or avoided, and the oxygen molecule content in the sample chamber is reduced through the synergistic effect of the oxygen absorption sources and the vacuum pump; under the structure, in order to prevent the sample from being oxidized, the pressure in the sample chamber is less than 10pa.

Description

technical field [0001] The invention relates to the field of vacuum heating, in particular to a vacuum heating device. Background technique [0002] The vacuum heating device is mainly composed of a vacuum pump, a furnace body, a heating body and a pipeline. There are various types, including a vacuum heat treatment furnace, a vacuum brazing furnace and a heating vapor deposition device. Oxidation occurs in the reaction, usually most vacuum heating devices require the vacuum degree in the heating device to be better than 10 before starting heating - 3 Pa, such as vacuum welding furnace, vacuum heat treatment furnace and thermal evaporation device, etc. [0003] The source of oxygen molecules in the heating device is mainly the release of oxygen adsorbed on the inner surface of the device and the air overflow in the environment. Therefore, the sealing performance of the device and pipeline and the pumping rate and stability of the vacuum system are important factors affecti...

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Problems solved by technology

[0006] Although the film deposition equipment provided by the above two patents can also vacuumize the chamber, the former has a complex structure and is difficult to operate, and the oxygen content inside the chamber of the two is only related to the degree of vacuum in the chamber, so the chamber’s The vacuum degree is extremely high, which does not solve the problem that the equipment has high requirements in terms of vacuuming time and equipment maintenance costs.

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