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Sodium persulfate micro-etching additive and application thereof

A technology of sodium persulfate and additives, applied in the field of sodium persulfate micro-etching additives, can solve the problems of inability to obtain the amount of bite corrosion, high cost of use, reduction of the amount of bite corrosion and bite corrosion rate, etc. Dosage, effect of promoting sustained response

Pending Publication Date: 2022-07-29
上海富柏化工有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the PCB board treated with the above-mentioned sodium persulfate (SPS) can also complete micro-etching, due to the Cu 2+ and Na 2 SO 4 content continued to increase, Na 2 S 2 o 8 As it is continuously consumed, its biting amount and biting rate will gradually decrease, so a stable biting amount cannot be obtained, and the reaction biting rate needs to be based on the high concentration of sodium persulfate (SPS), and the cost of use is relatively high

Method used

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  • Sodium persulfate micro-etching additive and application thereof
  • Sodium persulfate micro-etching additive and application thereof
  • Sodium persulfate micro-etching additive and application thereof

Examples

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Effect test

Embodiment 1

[0036] A kind of sodium persulfate micro-etching additive, by every 1kg, each component and its corresponding weight are as shown in table 1, and make by following preparation method:

[0037] Weigh azole compound, narrow distribution alkyl alcohol ether, triazine compound, silane coupling agent and water according to the proportion and mix at 2000r / min for 30min until uniform to obtain sodium persulfate micro-etching additive;

[0038] The azole compound is 2-aminobenzimidazole, the narrow distribution alkyl alcohol ether is Berol 260, the triazine compound is 2,4,6 tris(aminocaproic acid group)-1,3,5 triazine, silane coupling The joint agent is KH-570.

Embodiment 2-6

[0040] A kind of sodium persulfate micro-etching additive, the difference from Example 1 is that each component and its corresponding weight are as shown in Table 1.

[0041] Each component of sodium persulfate micro-etching additive and its weight (g) in the embodiment 1-6 of table 1

[0042]

Embodiment 7

[0044] A sodium persulfate micro-etching additive, the difference from Example 1 is that the azole compound is 2-aminothiazole.

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Abstract

The invention relates to the technical field of micro-etching treatment of printed circuit boards, in particular to a sodium persulfate micro-etching additive and application thereof. The sodium persulfate micro-etching additive is prepared from the following components in percentage by weight: 0.3-0.5% of an azole compound, 0.1-0.2% of narrow-distribution alkyl alcohol ether, 0-0.1% of a triazine compound, 0-0.2% of a silane coupling agent and the balance of water. By adding the sodium persulfate micro-etching additive, the use amount of sodium persulfate (SPS) is remarkably reduced, the use cost is saved, and meanwhile, the adhesive force for adhering dry and wet films in the post-process is improved, so that the surface performance and the manufacturing yield of the PCB are guaranteed.

Description

technical field [0001] The present application relates to the technical field of micro-etching treatment of printed circuit boards, and more particularly, to a sodium persulfate micro-etching additive and its application. Background technique [0002] Printed circuit board, also known as PCB board, is one of the important components in the electronics industry. It is often used as a carrier for the electrical interconnection of electronic components. Because of its features such as miniaturization, light weight, and high-speed signal transmission, it is widely used. Applied to the field of integrated circuits, the copper surface micro-etching process of the PCB board will directly affect the final performance of the PCB board. Therefore, how to improve the copper surface micro-etching process to prepare the PCB board with excellent performance has become the main task at this stage. research topic. [0003] The copper surface micro-etching treatment methods in the related a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 夏金良饶猛
Owner 上海富柏化工有限公司
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