High-current probe arm testing device

Abstract

The invention discloses a high-current probe arm testing device, which comprises a mounting seat, a probe seat, a multi-contact probe and a gland, and is characterized in that the probe seat is fixed at the front end of the mounting seat through a screw, and the multi-contact probe is mounted on the probe seat and is clamped and fixed through the gland; the mounting seat is a high-temperature-resistant insulating mounting seat, the needle seat and the gland are respectively a metal needle seat and a metal gland, the surfaces of the needle seat and the gland are both integrally plated with gold, and the surface of the multi-contact probe is also integrally plated with gold; the upper end of the needle seat is provided with a cable installation part used for fixing a cable. The surfaces of the probe seat, the multi-contact probe and the gland are all subjected to overall gold plating treatment, so that during high-current and high-voltage testing work, the temperature generated by a plurality of pins at the front end of the multi-contact probe can be quickly and uniformly conducted to the probe plate through gold-coated layers on the surfaces of the pins, and the temperature of the pins is reduced. And then the temperature is transmitted to the probe seat and the gland through the upper and lower surfaces of the probe plate, so that the temperature of the test probe is quickly reduced.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing, in particular to a high-current probe arm testing device. Background technique [0002] The DC probe card is a connection medium between the detection instrument and the integrated circuit chip. The probe card contacts the test signal (current or voltage) of the detection device to the integrated circuit chip to achieve the function of testing, and it is very important to need To transmit test signals stably, the most commonly used probe cards are epoxy probe cards and blade probe cards, but this type of probe card cannot meet certain tests, such as high current and high voltage tests, The material, coating, and manufacturing process of the needle body cannot allow high current and high voltage to transmit signals through the needle body. [0003] The quality of the general test probe is mainly reflected in the following shortcomings: [0004] 1. Generally, the higher the cur...

AI Technical Summary

Problems solved by technology

[0004] 1. Generally, the higher the current, the higher the temperature. When testing in a high temperature environment, the probe body cannot withstand high temperature, and the probe is easily damaged.

[0005] 2. When the tested chip is a high-power chip, the power is high, and the needle body cannot reach the ability to conduct a large current

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