Wafer thinning equipment and use method thereof

Abstract

The invention discloses wafer thinning equipment and a use method thereof, and relates to the technical field of wafer processing, and the wafer thinning equipment comprises a base, a grinding mechanism, a liquid pumping mechanism and a liquid suction assembly. The grinding mechanism works to carry out thinning grinding operation on the wafer, and the liquid pumping mechanism can be driven to work while grinding is carried out, so that in the thinning grinding process, the grinding efficiency is improved; polishing liquid and waste materials generated by grinding enter the liquid suction assembly under the action of centrifugal force generated by rotation of the grinding mechanism and the rotating disc and the suction force action of the liquid suction mechanism, so that the situation that the waste materials generated by grinding damage the top of a wafer, the wafer obtained after grinding cannot be used, and resource waste is caused is prevented; and the flow speed of the polishing solution can be increased to a certain degree, a grinding product can be timely separated from a machined surface, the temperature of a machined area can be reduced, the temperature of the machined surface is relatively consistent, and therefore good surface quality is obtained, the quality of the thinned wafer is guaranteed, and personnel use is facilitated.

Description

technical field [0001] The present invention relates to the technical field of wafer processing, in particular to a wafer thinning device and a method for using the same. Background technique [0002] The progress of integrated circuit manufacturing technology comes first from the requirements of market demand, followed by the requirements of competition. In the manufacture of integrated circuits, semiconductor silicon material is an important substrate material for integrated circuits due to its abundant resources, low manufacturing cost and good manufacturability. From the perspective of the cross-sectional structure of integrated circuits, most integrated circuits are fabricated on the shallow surface layer of the silicon base material. Due to the requirements of the manufacturing process, high requirements are placed on the dimensional accuracy, geometric accuracy, surface cleanliness and surface microlattice structure of the wafer. Therefore, in hundreds of process fl...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the existing problems in the prior art that the wafer surface cannot be purged, which will cause the wafer surface and residual dust particles to cause damage to the wafer during the thinning operation, and during grinding When it is used, it is impossible to effectively absorb the waste liquid generated by grinding, and the impurities generated by grinding will also cause damage to the wafer and cause unnecessary losses. A wafer thinning equipment and its use method are proposed

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