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Advanced plastic flexible electronic component 3D printing integrated circuit technology

A technology of electronic components and integrated circuits, which is applied in the field of 3D printed integrated circuit technology of flexible electronic components, can solve the problems of too large internal grooves, too thick circuits, and not easy to bend, so as to improve the reaction speed, realize bendability, The effect of reducing the resistance

Pending Publication Date: 2022-08-02
苏州链芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the above-mentioned method of using double-layer advanced plastics also has some disadvantages, such as the base is too thick to bend easily, the transparency is not high, the internal environment is not easy to see, and the internal groove is too large to cause the circuit to be too thick. Difficulties that must be solved with plastic as a substrate

Method used

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  • Advanced plastic flexible electronic component 3D printing integrated circuit technology
  • Advanced plastic flexible electronic component 3D printing integrated circuit technology
  • Advanced plastic flexible electronic component 3D printing integrated circuit technology

Examples

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Embodiment 1

[0045] This embodiment mainly introduces a method for 3D printing integrated circuits of advanced plastic flexible electronic components; please refer to the process flow figure 1 , figure 1 The invention provides a flow chart of an advanced plastic flexible electronic component 3D printing integrated circuit process.

[0046] An advanced plastic flexible electronic component 3D printing integrated circuit process, which includes the following steps:

[0047] Step S1, selecting advanced plastics as the base;

[0048] Step S2, laser mask projection processing the substrate to form deep grooves;

[0049] Step S3, backfilling the metal paste;

[0050] Step S4, sintering the metal paste to form.

[0051] Further, in the step S2, the width of the deep groove is 5-20 microns; the depth of the deep groove is 75-85 microns.

[0052] Further, in the step S2, the inner surface of the deep groove is an uneven plane structure.

[0053] Further, the advanced plastic material includes...

Embodiment 2

[0062] This embodiment mainly introduces an optimal method for the 3D printing integrated circuit process of advanced plastic flexible electronic components.

[0063] An advanced plastic flexible electronic component 3D printing integrated circuit process, which includes the following steps:

[0064] Step S1, selecting advanced plastics as the base;

[0065] Step S2, laser mask projection processing the substrate to form deep grooves;

[0066] Step S3, backfilling the metal paste;

[0067] Step S4, sintering the metal paste to form.

[0068] Further, in the step S2, the width of the deep groove is 12.5 microns; the depth of the deep groove is 80 microns.

[0069] Further, in the step S2, the inner surface of the deep groove is an uneven plane structure.

[0070] Further, the advanced plastic material includes one or two combinations of polyimide or polyethersulfone resin.

[0071] Further, in the step S1, the thickness of the substrate is 100 microns.

[0072] Further, t...

Embodiment 3

[0075] Based on the above Embodiment 1, this embodiment mainly introduces a method for backfilling metal paste in the 3D printing integrated circuit process of advanced plastic flexible electronic components. For the specific method, please refer to figure 2 , which includes the following steps:

[0076] Step S31, install the front and rear squeegee strips of the 3D printer to ensure that the squeegee is flat, and then install the squeegee bracket;

[0077] Step S32, adjusting the speed and pressure of the 3D printer;

[0078] Step S33 , using a 3D printer to print the metal paste on the pattern substrate for backfilling.

[0079] Further, the front and rear squeegee strips of the 3D printer are squeegee strips with a hardness of 100-150.

[0080] Further, before step S31, the uniform metal paste needs to be rotated.

[0081] Further, the oblique opening of the squeegee is 500 microns;

[0082] Further, the height of metal paste backfill is the same as that of advanced pl...

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Abstract

The invention designs an advanced plastic flexible electronic component 3D printing integrated circuit technology. The technology comprises the following steps: S1, selecting advanced plastic as a substrate; s2, performing laser mask projection processing on the substrate to form a deep groove; s3, metal paste is backfilled; and S4, the sintered metal paste is formed. According to the invention, the thickness of the substrate is 90-110 microns, the width of the substrate penetrating into the groove is 5-20 microns, and the depth of the substrate penetrating into the groove is 75-85 microns; and meanwhile, by designing the mode that the inner surface of the deep groove is of an uneven plane structure and the inner groove is deep and thinned, thinning of the substrate, transparent realizable bending of the substrate and stable connectivity in the substrate are achieved.

Description

technical field [0001] The invention belongs to the field of integrated circuit design, and in particular relates to an advanced plastic flexible electronic component 3D printing integrated circuit process. Background technique [0002] In the design of integrated circuits, with the development of chip technology, the packaging technology of electronic chips has become the final step in the design of chip modules, and it is also the key to determine whether the chip can be used normally. The final step for successful use. The development of packaging technology research is very fast on a global scale, and the challenges and opportunities it faces are unprecedented since the advent of electronic products; the problems involved in packaging are so wide that they are rare in many other fields. The material of the substrate also limits the development of chip packaging technology. Currently, the widely used substrate materials are less resistant to high temperature. Therefore, ...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/498
CPCH01L21/4846H01L23/49894
Inventor 杨志强陈健平
Owner 苏州链芯半导体科技有限公司