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Leveling and polishing device and method using femtosecond pulse laser

A femtosecond pulse and polishing device technology, applied in auxiliary devices, laser welding equipment, auxiliary welding equipment, etc., to improve surface roughness, reduce processing errors, and maximize output

Pending Publication Date: 2022-08-05
21TH CENTURY CO LTD
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  • Abstract
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  • Claims
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Problems solved by technology

[0024] In addition, the object of the present invention is not to melt the metal surface to improve the surface roughness like traditional laser polishing, but to irradiate the metal surface with a femtosecond laser, so that no damage occurs on the surface of the processed object. Device and method for improving surface roughness in case of thermal deformation

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  • Leveling and polishing device and method using femtosecond pulse laser
  • Leveling and polishing device and method using femtosecond pulse laser
  • Leveling and polishing device and method using femtosecond pulse laser

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Embodiment Construction

[0051] In the following, the invention will be explained in more detail by means of preferred embodiments according to the accompanying drawings.

[0052] It should be clear that planning as used in the present invention means a process of making a macro profile highly flat, which is an inventive term made by the applicant to distinguish it from a polishing process, and is used as the same as reducing The Ra value and the Ry value of the roughness in the microscopic angle have different meanings for polishing.

[0053] Generally, when viewed on the basis of the precision of precision grinding, the leveling process of the present invention has a processing degree of about 10 μm, and the polishing process has a processing degree of about 0.8 μm, and the two processes are strictly distinguished and used.

[0054] figure 1 is a schematic diagram showing the state of the material section before and after the process by the conventional laser polishing work, and figure 2 The stat...

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Abstract

The present invention relates to a device for performing polishing for improving surface roughness after flattening a large-area planar workpiece by using femtosecond pulse laser. The position fixing part is provided with a table on which the processed object is arranged to process the surface of the processed object, a fixing jig for fixing the processed object on the table, and a moving device for moving the table on the X axis and the Y axis, and the surface shape measuring part measures the height of a plurality of measuring points limited on the surface of the processed object. The laser processing unit performs a leveling process by irradiating femtosecond pulse laser light only to the processing region on the basis of the obtained surface shape data, and then performs irradiation of femtosecond pulse laser light of another predetermined power. The control unit receives the surface shape data and converts the surface shape data into surface data for leveling processing, and controls the driving of the laser processing unit so as to apply processing parameters input to a processing region determined on the basis of the surface data to level the laser processing unit.

Description

technical field [0001] The present invention relates to a leveling and polishing apparatus and method using a femtosecond pulsed laser, and more particularly, to a leveling process that achieves flatness of large-area planar workpieces such as precision molds used in the manufacture of laminated electronic ceramics. After that, an apparatus and method for a polishing process for improving the surface roughness of a large-area flat workpiece are performed. Background technique [0002] The grinding process in the broad sense refers to a process method for smoothing the surface shape of a workpiece and improving the surface roughness by various methods. [0003] Among them, the polishing to smooth the surface of the workpiece is constituted by grinding by friction of fine abrasive grains, and as a method of improving the surface roughness, it is generally made of cloth, leather, felt, etc. The polishing pad (buff) is constructed by using abrasive polishing (polishing) operati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/352B23K26/0622B23K26/142B23K26/70B23K26/03
CPCB23K26/3576B23K26/0622B23K26/142B23K26/702B23K26/032B23K26/0624B23K37/0443B23K26/0853B23K26/16B23K26/03B23K26/36
Inventor 金成焕姜炯植柳东频
Owner 21TH CENTURY CO LTD
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