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Low-viscosity high-thixotropy epoxy resin sealant as well as preparation method and application thereof

A technology of epoxy resin and thixotropy, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of poor sealing effect, and achieve the effect of remarkable effect and low viscosity

Pending Publication Date: 2022-08-05
池州科成新材料开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a sealing material for electronic products, epoxy resin is required to have good fluidity. The viscosity at room temperature is required to be controlled below 4000mPa·s. However, in the process of sizing, the sealing effect is often caused by the flow and penetration of the glue. not good

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A low-viscosity high-thixotropic epoxy resin sealant, comprising A component and B component mixed;

[0022] Wherein, the A component is made up of the following components, calculated by weight percentage: 80% bisphenol A epoxy resin E12, 10% dodecyl glycidyl ether, 1% defoamer 6201, 0.5% gas-phase dioxide Silicon, 0.5% polyamide wax, 4% carboxyl-terminated liquid nitrile rubber, 4% polysulfide rubber;

[0023] Component B is made from the following components, by weight: 95% polytetrahydrophthalic anhydride, 1% triethanolamine, 4% benzoyl peroxide;

[0024] The above-mentioned low-viscosity and high-thixotropic epoxy resin sealant preparation method, the steps are as follows:

[0025] (1) Add bisphenol A epoxy resin, dodecyl glycidyl ether, and antifoaming agent 6201 into the three-necked flask at a time, heat to 60° C., mix and stir for 30 minutes, and rotate at a speed of 400 rpm, then add gas phase two Silica, polyamide wax, polysulfide rubber, and carboxyl-termi...

Embodiment 2

[0029] A low-viscosity high-thixotropic epoxy resin sealant, comprising A component and B component mixed;

[0030] Wherein, the A component is made of the following components, calculated by weight percentage: 80% bisphenol A epoxy resin E44, 12% ethylene glycol glycidyl ether, 1% defoamer 6201, 0.5% fumed silica , 1% polyamide wax, 2% carboxyl-terminated liquid nitrile rubber, 3.5% polysulfide rubber;

[0031] Component B is made from the following components, in percentage by weight: 95% phthalic anhydride, 5% benzoyl peroxide;

[0032] The above-mentioned low-viscosity and high-thixotropic epoxy resin sealant preparation method, the steps are as follows:

[0033] (1) Add bisphenol A epoxy resin E44, ethylene glycol glycidyl ether, and antifoaming agent 6201 into the three-necked flask at a time, heat to 60° C., and then mix and stir for 30 min at a rotational speed of 400 rpm, then add gas phase two Silica, polyamide wax, polysulfide rubber, and carboxyl-terminated liqui...

Embodiment 3

[0037] A low-viscosity high-thixotropic epoxy resin sealant, comprising A component and B component mixed;

[0038] Among them, the A component is made up of the following components, calculated by weight percentage: 80% bisphenol A epoxy resin E51, 15% phenyl glycidyl ether, 0.5% defoamer 6201, 0.5% fumed silica, 1% polyamide wax, 1% polysulfide rubber, 2% carboxyl-terminated liquid nitrile rubber;

[0039] Component B is made from the following components, calculated by weight percentage: 95% polytetrahydrophthalic anhydride, 1.5% triethanolamine, 3.5% benzoyl peroxide;

[0040] The above-mentioned low-viscosity and high-thixotropic epoxy resin sealant preparation method comprises the following steps:

[0041] (1) Add bisphenol A epoxy resin E51, phenyl glycidyl ether, and antifoaming agent 6201 into the three-necked flask at one time, heat to 60°C, and then mix and stir for 30 minutes at a rotational speed of 400 rpm, and then add fumed silica , polyamide wax, polysulfide...

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Abstract

The invention discloses a low-viscosity high-thixotropy epoxy resin sealant and a preparation method thereof, and belongs to the technical field of electronic packaging adhesives. According to the prepared single-component epoxy resin adhesive, the viscosity of a mixture is 1900 mPa.s, the viscosity is low, the thixotropic index is 1.25, the thixotropic index is high, the mixture reaches the surface dry state at the temperature of 120-140 DEG C within 30-40 minutes, a cured product does not crack or blister at the high temperature of 240-260 DEG C, the effect is remarkable, and the single-component epoxy resin adhesive is suitable for high-temperature sealing electronic materials.

Description

[0001] This application is a divisional application with an application date of July 17, 2019, an application number of 201910645563.9, and the title of the invention "A low-viscosity high-thixotropic epoxy resin sealant and its preparation method". technical field [0002] The invention belongs to the technical field of electronic encapsulation adhesives, in particular to a low-viscosity and high-thixotropic epoxy resin sealant and a preparation method and application thereof. Background technique [0003] Epoxy resins generally refer to polymer prepolymers having two or more epoxy groups and using organic compounds such as aliphatic or aromatic as skeletons. At present, there are a wide range of epoxy resins with different functions. The structure of bisphenol A epoxy resin contains high polar molecular structures such as hydroxyl groups, epoxy groups and ether bonds, which can better generate intermolecular forces with adjacent interfaces. Due to its special properties, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C09J11/08
CPCC09J163/00C09J11/04C09J11/08C08L2205/035C08L2201/08C08L2203/206C08L77/00C08L13/00C08L81/04C08K7/26
Inventor 许苗苗陈建兵刘生明郝媛媛钟璇常城
Owner 池州科成新材料开发有限公司