Prepn process of superfine oxygen-free copper wire

Abstract

A preparation process of mciron level or nanometer level oxygen-free copper wire includes continuous oriented solidification of oxygen-free copper material to prepare oxygen-free copper rod blank of 5-30 mm diameter and with continuous cylindrical crystal structure; cold or warm rolling to reduce the diameter of copper rod to 8-15 mm; and drawing to produce superfine filament of 10-50 micron diameter. The superfine oxygen-free copper filament thus produced has continuous lengthwise fiber crystal structure of 1 nm to 10 micron diameter, and thus has excellent cold-machining extending and deforming capacity.

Description

technical field [0001] The invention belongs to the technical field of preparation of new nonferrous metal materials, and in particular provides an oxygen-free copper ultra-fine wire material and a preparation process thereof. Background technique [0002] With the development of electronic information, high-precision instruments and micro-machines, the demand for copper and copper alloy conductive wires and ultra-fine wires (10-50 μm in diameter) is rapidly increasing. Taking oxygen-free copper ultra-fine wires below 50 μm mainly used in the microelectronics industry (magnet wires, microelectronic device bonding wires, etc.) ~15% growth rate; the price per ton of ultra-fine wire is as high as 800,000 to 1,200,000 yuan (varies according to different specifications). It is generally required that this type of ultra-fine wire has high electrical conductivity, and the length of a single wire is more than 3000-5000m. However, due to problems such as broken ends and broken wire...

AI Technical Summary

Problems solved by technology

[0004] The invention solves the problem of complicated process for preparing oxygen-free copper ultra-fine wire, and develops a process for preparing oxygen-free copper ultra-fine wire. 500~5000m wire