Prepn process of superfine oxygen-free copper wire

A preparation process and ultra-fine wire technology, which can be used in wire processing, other household appliances, household appliances, etc., can solve problems such as the complexity of oxygen-free copper ultra-fine wire technology, and achieve excellent cold deformation ability, excellent electrical conductivity, and finished products high rate effect

Inactive Publication Date: 2004-08-11
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The invention solves the problem of complicated process for preparing oxygen-free copper ultra-fine wire, and develops a process for preparing oxygen-free copper ultra-fine wire. 500~5000m wire

Method used

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Embodiment Construction

[0010] Oxygen-free copper continuous fibrous crystal ultrafine wire with a diameter of 19.7 μm. Oxygen-free copper with a copper content of 99.99% is used as a raw material, wherein the oxygen content is between 5 and 20 ppm. First, oxygen-free copper is melted at 1250-1300°C, and a φ16mm billet is prepared on a dedicated continuous directional solidification equipment with a casting speed of 250mm / min by the down-draw method. The wire billet of φ9mm is rolled in one pass, and then the wire billet is roughly drawn to φ1mm through 11 passes by drawing method, and then the fine drawing is carried out until the ultra-fine wire of φ19.7μm is obtained. The inside of the prepared silk is a continuous fiber crystal structure, and the diameter of the fiber crystal is about 20-50 nm.

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Abstract

A preparation process of mciron level or nanometer level oxygen-free copper wire includes continuous oriented solidification of oxygen-free copper material to prepare oxygen-free copper rod blank of 5-30 mm diameter and with continuous cylindrical crystal structure; cold or warm rolling to reduce the diameter of copper rod to 8-15 mm; and drawing to produce superfine filament of 10-50 micron diameter. The superfine oxygen-free copper filament thus produced has continuous lengthwise fiber crystal structure of 1 nm to 10 micron diameter, and thus has excellent cold-machining extending and deforming capacity.

Description

technical field [0001] The invention belongs to the technical field of preparation of new nonferrous metal materials, and in particular provides an oxygen-free copper ultra-fine wire material and a preparation process thereof. Background technique [0002] With the development of electronic information, high-precision instruments and micro-machines, the demand for copper and copper alloy conductive wires and ultra-fine wires (10-50 μm in diameter) is rapidly increasing. Taking oxygen-free copper ultra-fine wires below 50 μm mainly used in the microelectronics industry (magnet wires, microelectronic device bonding wires, etc.) ~15% growth rate; the price per ton of ultra-fine wire is as high as 800,000 to 1,200,000 yuan (varies according to different specifications). It is generally required that this type of ultra-fine wire has high electrical conductivity, and the length of a single wire is more than 3000-5000m. However, due to problems such as broken ends and broken wire...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21F99/00C22F1/08
Inventor 谢建新王自东张鸿
Owner UNIV OF SCI & TECH BEIJING
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