Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic component

A technology of electronic components and circuits, applied in the directions of printed circuit components, electrical components, circuits, etc., can solve problems such as difficulty in designing electronic components

Inactive Publication Date: 2004-08-11
PANASONIC CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, expertise is required to prevent electromagnetic shielding from being weakened, which makes it difficult to design electronic components

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component
  • Electronic component
  • Electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Embodiments of the present invention are described below with reference to the accompanying drawings.

[0013] figure 1 is a partially exploded perspective view of a dielectric filter. The dielectric filter includes circuit elements such as dielectric resonators 2, chip capacitors 3 and others mounted on a substrate 1 by reflection flow soldering.

[0014] The substrate 1 comprises a rectangular bare substrate 1a made of glass epoxy resin. On the upper surface of the substrate 1, the following parts are provided: a) a ground electrode 4 for mounting the dielectric resonator 2, b) partially formed circuit electrodes 5a and 5b for mounting and connecting the chip capacitor 3 and others element. On the lower surface, a ground electrode 6 is provided to cover substantially the entire surface, as figure 2 As shown in , and the input / output electrodes 7 are provided at both ends of one side. Circuit electrodes 5a on the upper surface are coupled to input / output electrod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a surface-mount electronic component arranged on, e.g., a printing wiring assembly board through heat treatment, such as reflow welding and the like. An exposed substrate base is made exposed through mesh parts. An electrode is formed into a reticulated form so that each side of the independent mesh electrode parallels to each edge of the substrate base, while width of the mesh electrode block is less than that of the exposed substrate base. The structure can ensure high-level planarity of the mounting surface of the electronic component without impairing shielding efficiency thereof.

Description

technical field [0001] The present invention relates to surface mount electronic components which are soldered to, for example, printed wiring assembly boards (herein referred to as PWAs) by a heating step such as reflected flow soldering. Background technique [0002] Conventional electronic components used in surface mounting and soldered to PWAs by a heating step such as reflected flow soldering comprise a substrate having an upper surface and a lower surface. The upper surface is provided with a plurality of electrodes on which circuit elements are mounted. The lower surface of the element is provided with ground electrodes, which cover substantially the entire lower surface to enhance electromagnetic shielding. [0003] Since the lower surface of the electronic component described above is a mounting surface to be surface-mounted to the PWA, the lower surface requires precise flatness. In order to meet this need, a method is used in which at least one non-electrode po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/18H01H47/00H01P1/205H05K1/02H05K3/30
Inventor 北雅己田中正治织田学
Owner PANASONIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com