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Grinding fluid composition

A technology of composition and polishing liquid, applied in the direction of polishing composition containing abrasive, grinding device, grinding machine, etc.

Inactive Publication Date: 2005-02-02
KAO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such microscopic abrasions have not been adequately reduced by previous methods.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0087] As shown in Table 1, 7 parts by weight of colloidal silica (D10: 45nm, D50: 58nm, D90: 90nm) and 1 part by weight of 35% hydrogen peroxide (manufactured by Asahi Denka) were mixed with the amount shown in Table 1. Mix one of the following additives A to D, and add water to the rest to make the total weight 100 parts. Wherein embodiment 5, 6 is adjusted to pH2.0 with 61% nitric acid (Wako special grade). The colloidal silica used in Examples 1 to 6 and the following comparative examples 1 to 7 is 65% by weight of colloidal silica with D50 of 55 nm and D90 of 65 nm, and colloidal silica 35% with D50 of 80 nm and D90 of 100 nm. % by weight mixed.

[0088] The order of mixing is to dilute the colloidal silica slurry with water, and then slowly add additives to it under stirring for preparation, and be careful not to allow the slurry to gel. Finally, a predetermined amount of hydrogen peroxide is slowly added under stirring.

[0089] Auxiliary A: 1-hydroxyethylidene-1,1-d...

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PUM

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Abstract

A polishing composition comprising an abrasive, an oxidizing agent, a polishing accelerator, and water, wherein the polishing accelerator comprises an organic phosphonic acid; a method for manufacturing a substrate, comprising polishing a substrate to be polished with the above polishing composition; a method for polishing a substrate comprising polishing a substrate to be polished with the above polishing composition; a process for reducing fine scratches of a substrate, comprising polishing a substrate to be polished with the above polishing composition; and a process for accelerating polishing of a magnetic disk substrate, comprising applying the above polishing composition to a magnetic disk substrate to be polished. The polishing composition is highly suitable for polishing a magnetic disk substrate requiring high surface quality to be used in memory hard disk drives.

Description

technical field [0001] The present invention relates to a polishing liquid composition, a substrate manufacturing method using the polishing liquid composition, a method for polishing a polished substrate using the above polishing liquid composition, a method for reducing micro-scratches on the polished substrate using the above polishing liquid combination, and A method of promoting polishing of a substrate for a magnetic disk using a polishing liquid composition. Background technique [0002] In recent memory hard disk drives, in order to achieve high capacity, small diameter, and increase recording density, the only way to reduce the floating amount of the magnetic head is to reduce the unit recording area. At the same time, as far as the manufacturing process of magnetic disk substrates is concerned, the requirements for surface quality after polishing have become stricter year by year, corresponding to the low float of the magnetic head, surface roughness, micro wavines...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/00C09G1/02C09K3/14G11B5/84H01L21/304
CPCC09G1/02C09K3/1463
Inventor 大岛良晓
Owner KAO CORP