Mixed IC device

Abstract

The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30 A, 31 A, 32, 33 A, 34 A and 38 . In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire. These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.

Description

technical field [0001] The present invention relates to a hybrid integrated circuit device, especially a hybrid integrated circuit device which can reduce assembly man-hours by reducing soldering of thin metal wires. Background technique [0002] In the past, hybrid integrated circuit devices installed in electronic equipment formed conductive patterns on, for example, printed circuit boards, ceramic boards, or metal substrates, and mounted active components such as LSI or discrete TRs, chip capacitors, and chip resistors on them. or passive components such as coils. In addition, the above-mentioned conductive patterns are electrically connected with the above-mentioned components so as to realize a circuit with specified functions. [0003] Figure 19 An example circuit is shown, giving Figure 19 . This circuit is an audio circuit and the components shown in the diagram are actually assembled into a Figure 20 Case. [0004] exist Figure 20 In , the outermost rectang...

AI Technical Summary

Problems solved by technology

However, when the chip is fixed with solder, the solder will spread to the side of the chip and cause a short circuit, so it cannot be used on the hybrid integrated circuit substrate.

[0010] Also, if a component that fixes a semiconductor element to a lead frame is mounted on a hybrid IC substrate, since the component is very large in size, the size of the hybrid IC substrate will increase

[0011] As mentioned above, even if the hybrid integrated circuit substrate is used to reduce the cost, the cost will increase due to the inability to assemble very small chips and the long assembly process.

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