Method for preparing polymer-based conductive composite material with low excess effusion value
A conductive composite material, percolation value technology, applied in conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of low stability, poor material processing performance and mechanical properties, poor compatibility, etc. High stability, good processability and mechanical properties, and low cost
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Embodiment 1
[0011] At room temperature, slowly add conductive carbon black with a particle size of 50nm into a polyether polyurethane emulsion with a concentration of 15%. The particle size of the polyurethane emulsion is about 290nm. Then, the mixture was coated on an epoxy plate with comb-shaped electrodes and dried naturally at room temperature. The percolation value of the conductive composite material prepared by this method is 0.3%.
Embodiment 2
[0013] At room temperature, slowly add conductive carbon black with a particle size of 50nm to a polyester polyurethane emulsion with a concentration of 15%. The particle size of the polyurethane emulsion is about 280nm. Polyurethane emulsion, and then, this mixed solution is coated on the epoxy plate that has comb-shaped electrode and is dried naturally at room temperature. The percolation value of the conductive composite material prepared by this method is 0.5%.
Embodiment 3
[0015] Slowly add conductive carbon black with a particle size of 50nm to the polyether polyurethane emulsion with a concentration of 15% at room temperature. The particle size of the polyurethane emulsion is about 240nm. Then, the mixture was coated on an epoxy plate with comb-shaped electrodes and dried naturally at room temperature. The percolation value of the conductive composite material prepared by this method is 0.6%.
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Abstract
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