Static relay and communication device using static relay

Abstract

Fixed contacts (23A, 24A) are provided on the upper surface of a silicon substrate (21). Signal lines (23, 24) electrically continuous with the fixed contacts (23A, 24A) are provided so as to pass through a silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (32, 33) electrically continuous with the signal lines (23, 24) are provided on the reverse surface of the silicon substrate (21). A fixed electrode (22) is provided on both sides of the fixed contacts (23A, 24A). Wiring conductors (30, 31) electrically continuous with the fixed electrode (22) are provided so as to pass through the silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (34, 35) electrically continuous with the wiring conductors (30, 31) are provided on the reverse surface of the silicon substrate (21). Through holes (26, 27) of the silicon substrate (21) through which the signal lines (23, 24) are passed and through holes (28, 29) of the silicon substrate (21) through which the wiring conductors (30, 31) are passed are hermetically sealed by a movable substrate (40) or a cap (50).

Description

technical field [0001] The present invention relates to an electrostatic relay in which a movable contact is opened and closed by electrostatic attraction and a communication device using the relay. In particular, it relates to a small electrostatic micro-relay made by micromachining technology. Background technique [0002] As an electrostatic microrelay, we have hitherto known the relay disclosed in the paper "Micro Machined Relay for High Frequency" (Y. Komura, et al.). FIG. 1 is an exploded perspective view showing the structure of this electrostatic microrelay. In addition, the sectional view of FIG. 2 is a figure which schematically shows this structure. This electrostatic microrelay can be roughly divided into two parts: a fixed substrate 1 and a movable substrate 2 . On the fixed substrate 1, two signal lines 5, 6 are formed on the substrate 3, and the ends of the respective signal lines 5, 6 face each other with a small gap therebetween, forming fixed contacts 5S...

AI Technical Summary

Problems solved by technology

[0011] However, if the electrostatic microrelay is miniaturized, the electrode area of ​​the movable electrode and the fixed electrode is also reduced, so the electrostatic attraction acting between the electrodes becomes smaller, and the contact force between the contacts decreases.

As a result, the contact resistance between the contacts increases and the insertion loss also increases

[0012] In this way, in the existing electrostatic microrelays of such a structure, because there is a trade-off relationship between the resistance of the signal line and the contact force between the contacts, miniaturization of the electrostatic microrelay is not necessarily related to improving the insertion loss of the electrostatic microrelay.

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