Electric connector and its producing method
An electrical connection and component technology, applied in the field of anisotropic conductive components, can solve the problems of minimization, complex structure, inconvenience, etc.
Inactive Publication Date: 2006-08-23
JAPAN AVIATION ELECTRONICS IND LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Conventional connection parts with such mechanical connection means are rather complex in construction, resulting in the disadvantage that it prevents miniaturization and is not robust
In Japanese Patent Specification JP 7-220846 published on August 18, 1995, connecting parts are produced by bonding a metal film to an insulating elastic material and laser machining channels in the metal film, which are then machined perpendicular to the channels The direction is bent into a U shape, so that the elastic material faces inwards, which requires laser machining of each channel on the connecting part one by one, which makes the process cumbersome and inconvenient
Method used
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Embodiment Construction
[0036] figure 1 The sequence of an embodiment of the process steps of the method of manufacturing an electrical connection part according to the present invention is illustrated, and these steps are specifically described below.
[0037] (1) A mold 11 is provided. On the surface of the mold 11, a plurality of protrusions 12 corresponding to a conductor pattern are formed. As shown in the embodiment in the figure, the protrusions 12 include a plurality of ridges arranged at predetermined intervals, such as figure 2 shown. However, the spacing between the ridges does not necessarily require an equidistant arrangement.
[0038] (2) At first, adopt vapor deposition, sputtering deposition or electroplating (electroless plating or electrolytic plating) to form a metal film that has relatively weak bonding performance (or weak adhesion force) for the mold on mold 11, with A first layer 13 is provided.
[0039] (3) The next step is to form on the first layer 13 a main conductive ...
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Abstract
A metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.
Description
[0001] This application is a divisional application of the invention patent application with the application number 00137288.2, the application date is November 18, 2000, and the invention title is "electrical connection component and its manufacturing method". technical field [0002] The present invention relates to electrical connecting parts, such as connecting parts for electrically connecting plug-in boards or circuit boards to each other, and also relates to terminals and electrodes interconnected on flexible printed plug-in boards or circuit boards such as flat cables and circuit boards Anisotropic conductive member and its manufacturing method. Background technique [0003] Heretofore, prior art connectors that electrically connect socket boards to each other, for example, typically have the required mechanism / assembly for mechanically securing the connector to the socket board and maintaining the connection t...
Claims
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IPC IPC(8): H05K3/00H05K3/10H01R11/01H01B5/14H01B5/16H01B13/00H01R43/00H05K1/14H05K3/20H05K3/40
CPCH05K2203/0338H05K3/4038H05K2201/0317H05K2203/0108H01R12/52H05K2201/09509H05K3/20Y10T29/49126Y10T29/49155Y10T29/49158Y10T29/49176Y10T29/4921Y10T29/4922Y10T29/49222
Inventor 田井富茂小口慎雄
Owner JAPAN AVIATION ELECTRONICS IND LTD