Raw chip laminating apparatus and method, and laminated ceramic electronic element making method
A lamination and green sheet technology, applied in the manufacture of multilayer circuits, electrical components, capacitors, etc., can solve problems such as reduced adhesion, peeling, and unstable cutting operations
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Embodiment 1
[0082] FIG. 1 is a schematic front sectional view for explaining a green sheet lamination method using a green sheet lamination apparatus according to Example 1 of the present invention.
[0083] First, a ceramic green sheet 3 made of a synthetic resin film such as polyethylene-on-titanate film and supported on a support film 2 is wound up on a roll 1 shown in FIG. 1 . In the present embodiment, the ceramic green sheet 3 is made of a material mainly composed of dielectric ceramics for constituting a multilayer ceramic capacitor.
[0084] Reel 1 is separated and reel 4 is arranged. An elongated member is wound on a roll 4, and this elongated member is laminated on the support film 2 by cutting the ceramic green sheet 3 and removing the remaining part of the ceramic green sheet after removing the rectangular ceramic green sheet as described later. . At least one of the rolls 1, 4 is driven in rotation to convey the ceramic green sheet 3 in its longitudinal direction.
[0085]...
Deformed example 1
[0107] FIG. 5 is a front cross-sectional view illustrating a first modification of the green sheet lamination apparatus of the above-mentioned embodiment. In the green sheet lamination apparatus 21 shown in FIG. 5 , the elongated ceramic green sheet 3 is conveyed between a pair of rolls in a state supported by the support film 2 as in the previous embodiment. In FIG. 5 , the longitudinal direction of the ceramic green sheet 3 is a direction perpendicular to the paper surface of the drawing. In FIG. 5 , a cross-sectional view showing a state where the ceramic green sheet 3 and the support film 2 are positioned on the dicing and laminating stage 22 is shown.
[0108] On the other hand, the cutting member 8 and the lamination member 9 are arranged above the ceramic green sheet 3 . The cutting member 8 and the lamination member 9 are configured in the same manner as in the first embodiment. The difference is that the cutting member 8 and the lamination member 9 are arranged in a...
Deformed example 2
[0113] In Modification 2 shown in FIG. 7 , a rectangular ceramic green sheet 31 is supported on a support film 32 composed of a rectangular synthetic resin film. Here, such a rectangular ceramic green sheet 31 is supplied to a green sheet lamination apparatus including a cutting member 8 and a lamination member 9 . As shown in FIG. 8, the configurations of the cutting member 8 and the lamination member 9 are exactly the same as those of the cutting member 8 and the lamination member 9 of the previous embodiment.
[0114] In the second modified example, as described above, the rectangular ceramic green sheet 31 is loaded on the transport unit 33 in a state where it is supported on the rectangular support film 32 . The upper surface of the transport unit 33 is a flat surface. Therefore, the ceramic green sheet 31 can be cut by the cutting member 8 in this state by moving the conveyance unit 33 to be located below the cutting member 8 . Next, by moving the transport unit 33 bel...
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