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Raw chip laminating apparatus and method, and laminated ceramic electronic element making method

A lamination and green sheet technology, applied in the manufacture of multilayer circuits, electrical components, capacitors, etc., can solve problems such as reduced adhesion, peeling, and unstable cutting operations

Inactive Publication Date: 2007-02-28
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, chipping of the ceramic green sheets may be generated, and the adhesiveness between the laminated ceramic green sheets 53a may be reduced to cause partial peeling.
In addition, due to the contact load between the cut surface of the ceramic green sheet 53a and the inner surface 56a of the cutting blade 56, the cutting operation of the next ceramic green sheet 53 also becomes unstable.

Method used

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  • Raw chip laminating apparatus and method, and laminated ceramic electronic element making method
  • Raw chip laminating apparatus and method, and laminated ceramic electronic element making method
  • Raw chip laminating apparatus and method, and laminated ceramic electronic element making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] FIG. 1 is a schematic front sectional view for explaining a green sheet lamination method using a green sheet lamination apparatus according to Example 1 of the present invention.

[0083] First, a ceramic green sheet 3 made of a synthetic resin film such as polyethylene-on-titanate film and supported on a support film 2 is wound up on a roll 1 shown in FIG. 1 . In the present embodiment, the ceramic green sheet 3 is made of a material mainly composed of dielectric ceramics for constituting a multilayer ceramic capacitor.

[0084] Reel 1 is separated and reel 4 is arranged. An elongated member is wound on a roll 4, and this elongated member is laminated on the support film 2 by cutting the ceramic green sheet 3 and removing the remaining part of the ceramic green sheet after removing the rectangular ceramic green sheet as described later. . At least one of the rolls 1, 4 is driven in rotation to convey the ceramic green sheet 3 in its longitudinal direction.

[0085]...

Deformed example 1

[0107] FIG. 5 is a front cross-sectional view illustrating a first modification of the green sheet lamination apparatus of the above-mentioned embodiment. In the green sheet lamination apparatus 21 shown in FIG. 5 , the elongated ceramic green sheet 3 is conveyed between a pair of rolls in a state supported by the support film 2 as in the previous embodiment. In FIG. 5 , the longitudinal direction of the ceramic green sheet 3 is a direction perpendicular to the paper surface of the drawing. In FIG. 5 , a cross-sectional view showing a state where the ceramic green sheet 3 and the support film 2 are positioned on the dicing and laminating stage 22 is shown.

[0108] On the other hand, the cutting member 8 and the lamination member 9 are arranged above the ceramic green sheet 3 . The cutting member 8 and the lamination member 9 are configured in the same manner as in the first embodiment. The difference is that the cutting member 8 and the lamination member 9 are arranged in a...

Deformed example 2

[0113] In Modification 2 shown in FIG. 7 , a rectangular ceramic green sheet 31 is supported on a support film 32 composed of a rectangular synthetic resin film. Here, such a rectangular ceramic green sheet 31 is supplied to a green sheet lamination apparatus including a cutting member 8 and a lamination member 9 . As shown in FIG. 8, the configurations of the cutting member 8 and the lamination member 9 are exactly the same as those of the cutting member 8 and the lamination member 9 of the previous embodiment.

[0114] In the second modified example, as described above, the rectangular ceramic green sheet 31 is loaded on the transport unit 33 in a state where it is supported on the rectangular support film 32 . The upper surface of the transport unit 33 is a flat surface. Therefore, the ceramic green sheet 31 can be cut by the cutting member 8 in this state by moving the conveyance unit 33 to be located below the cutting member 8 . Next, by moving the transport unit 33 bel...

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PUM

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Abstract

The subject of the invention is to provide an apparatus for laminating a blank, in which as a ceramic blank supported by a support film is cut, peeled from the support film and laminated, and the peeling in a laminated body and a sintered compact obtained after sintering is difficult to be generated such that cutting and lamination can be continuously and smoothly carried out. The solving means is described in the following. The apparatus for laminating the blank is equipped with a cutting component 8 (which is provided with a cutting edge 11 for cutting the ceramic blank 3 supported by the support film 2 to have a specific plane shape); and a laminating component 9 (which is arranged independently from the cutting component 8 and fixed by pressure to laminate the ceramic blank 3a of a specific plane shape cut on a laminated surface 9a).

Description

technical field [0001] The present invention relates to a green sheet lamination device, a green sheet lamination method, and a method for manufacturing laminated ceramic electronic components suitable for the manufacture of laminated ceramic electronic components such as laminated capacitors. Background technique [0002] Conventionally, various methods of manufacturing ceramic electronic components such as multilayer capacitors using very thin ceramic green sheets have been proposed. [0003] For example, Japanese Unexamined Patent Publication No. 5-6844 discloses a method of manufacturing the lamination head 51 by cutting (cutting) shown in FIG. 10 . Among them, the ceramic green sheet 53 is supported on a support film (film) 52 . [0004] With the ceramic green sheet 53 supported on the support film 52 positioned on the table 54, the cutting and laminating head 51 moves in the vertical direction as indicated by the arrow. The cutting and laminating head 51 has a main b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G4/30B28B11/14B28B11/00H01G13/00H05K3/46
CPCH01G4/30H01G13/00
Inventor 坂本义典川畑尚明
Owner MURATA MFG CO LTD