Dielectric ceramic composition

Abstract

A dielectric ceramic compact is provided which can be obtained by sintering at a low temperature of 1000° C. or less, can be obtained by co-sintering a dielectric ceramic composition with a metal having superior electrical conductivity, such as Ag, and has a high relative dielectric constant, a high Q and a small temperature coefficient of dielectric properties. The dielectric ceramic composition combines an xBaO-yTiO2-zReO3/2 ceramic composition and a glass composition; wherein 8<=x<=18, 52.5<=y<=65, 20<=z<=40, in which x, y, and z represent mole percent, x+y+z=100 and Re indicates a rare earth element, and the glass composition comprises about 10 to 25 wt % of SiO2, about 10 to 40 wt % of B2O3, about 25 to 55 wt % of MgO, 0 to about 20 wt % of ZnO, 0 to about 15 wt % of Al2O3, about 0.5 to 10 wt % of Li2O and 0 to about 10 wt % of RO in which R is at least one selected from the group consisting of Ba, Sr and Ca.

Description

technical field [0001] The present invention relates to a dielectric ceramic composition suitable for use in high frequency bands such as microwave or milliwave bands and useful for forming microwave resonators, filters and multilayer capacitors. The present invention also relates to a dielectric ceramic compact, a multilayer ceramic substrate formed from the dielectric ceramic compact, a ceramic electronic component, and a laminated ceramic electronic component. Background technique [0002] Previously, in order to miniaturize electronic components such as microwave resonators and filters, a structure formed of a dielectric ceramic material with a high relative permittivity was proposed instead of a cavity resonator. When ε is used to represent the relative permittivity of the dielectric material, by shortening the wavelength of the electromagnetic wave in the dielectric material to (1 / ε) of its wavelength in free space 1 / 2 , attempting to miniaturize microwave resonators ...

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Problems solved by technology

However, no materials that can meet the above requirements have been found so far.

[0007] For example, since the melting point of metals such as Ag, Au, or Cu is about 960-1063°C, while conventional dielectric ceramic compositions have a firing temperature of 1350°C or higher, it is difficult for such compositions to be superior to those described above. Conductive metals are sintered together

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