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Crosslinked base layer for sandwich fixed by two-point method and sticking method

A technology of cross-linking components and melting points, applied in the direction of coatings, adhesives, adhesive types, etc., can solve the problems of weak adhesion, low stability of washing and dry cleaning, etc., and achieve the effect of high stability

Inactive Publication Date: 2002-05-01
DEGUSSA AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] To address low wash and dry cleaning stability and weak adhesion, improved hot melt adhesive compounds and improved application techniques were developed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0026] Amino-terminated polypolyamides of Degussa Huels AG (VESTAMELT X 1027-P 1) and an encapsulated polyisocyanate dispersion prepared as described above with commercially available dispersants and thickeners, e.g. Intrasol 12 / 18 / 5 and Mirox TX, as described in DE-B 20 07 971, DE-B 22 29 308, DE-B24 07 505 and DE-B25 07 504, processed to a printable paste Screen printing equipment with CP 66 stencil printing on 35 g polyester fiber of high bulk yarn. Coating is 2g / m 2 . Disperse VESTAMELT X 1027-P816 on the undried paste spot, suck off the residue, dry and sinter in a drying oven at 130°C. Top coating is 5g / m 2 , so the total amount is 7g / m 2 .

[0027] Base point paste recipe:

[0028] 1500g water

[0029] 35g Mirox TX (polyacrylic acid derivative)

[0030] 40g Intrasol 12 / 18 / 5 (ethoxylated fatty alcohol)

[0031] 200 g of the polyisocyanate dispersion from Example 1 (approx. 5% trimerized IPDI)

[0032] 600g VESTAMELT X 1027-P 1

[0033] Amine-terminated VESTAMELT...

Embodiment II

[0039] Regarding Example II: Comparison with the State of the Art

[0040] A paste system based on copolyamide polyethylene was applied to the same interlayer substrate and dispersed, dried and bonded with the same topping material. The same amount is used for base point and upper point. Paste recipe:

[0041] 1500g water

[0042] 35g Mirox TX

[0043] 40g Intrasol 12 / 18 / 5

[0044] 400g Schaettifix 1820 (ND-polyethylene)

[0045] 200g VESTAMELT 751-PI

[0046] Schaettifix 1820 is a low-pressure polyethylene with a melting point of 128-130°C and an MFR value of 20g / 10min.

[0047] result:

[0048] Initial adhesion: 9N / 5cm

[0049] After washing at 60°C: 5N / 5cm

[0050] Back riveting: 0.9N / 10cm

[0051] The advantage of the method according to the invention is that the lower point is already crosslinked under dry conditions and the upper point is crosslinked during the melting process due to its end groups with the lower point, whereby optimal adhesion is achieved. Si...

Embodiment 3

[0056] 1500g water

[0057] 35g Mirox TX

[0058] 40g Intrasol 12 / 18 / 5

[0059] 400g VESTAMELT X 1316-P1

[0060] 200g VESTAMELT X 1310-P1

[0061] result:

[0062] At a joining temperature of 155°C, 16 seconds and a uniform pressure of 4kg / m on the shirt press 2 Under certain conditions, it will be with CP66 mesh and 16g / m 2 Coated 5cm wide interlayer strips (75g / m 2 Cotton) was fixed to a silanized outerwear material made of a cotton-polyester blend, and the resulting composite was then washed at 60°C.

[0063] Adhesive force: 21N / 5cm

[0064] After washing at 60°C: 19N / 5cm

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Abstract

A process for manufacturing a crosslinkable hot-melt adhesive compound for coating and / or laminating surface formations is described, wherein a crosslinking constituent is micro-encapsulated by a silanized polybutadiene.

Description

technical field [0001] The present invention relates to a process for the preparation of microencapsulated crosslinkable hot melt adhesive coatings based on copolyamides comprising microencapsulated polyisocyanate dispersions and commercially available amine terminated groups or Aqueous paste of copolyesters for the preparation of base dots in dual dot coatings as strikeback barriers. The upper spot contained an amine regulated copolyamide to ensure good binding to the lower spot. In particular, the present invention relates to hot melt adhesive compounds for use in the apparel industry, especially for web coatings of fixable interlayer materials in outer garments. It can also be used based on terephthalic acid, isophthalic acid and butanediol or butanediol with a small amount of up to 12 mol%, preferably 6 to 10 mol% of other diols, such as hexylene glycol or polyethylene glycol Copolyesters with terminal groups of OH and a melting point of 100-150°C are used instead of cop...

Claims

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Application Information

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IPC IPC(8): C08G18/40C08G18/60C08G18/70C08G18/79C08L9/00C08L51/04C09D115/00C09D167/00C09D175/04C09D201/00C09J115/00C09J123/22C09J167/00C09J167/02C09J175/04C09J177/00C09J201/00D06M15/572D06M17/04D06M17/08D06M17/10D06M23/12D06M23/16D06N7/00
CPCC08L9/00D06N7/00D06N2205/20D06M17/10D06N2205/06C08G18/706C08G18/792D06N2203/042C09J167/02D06M17/08C09J177/00C08G2170/20C08L51/04D06N2211/10D06M17/04C08G18/603D06N7/0092C08L2666/08C08L2666/28C09J123/22
Inventor U·西蒙G·克勒
Owner DEGUSSA AG
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