Manufacturing method of semiconductor device

A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor device, electric solid-state device, etc., can solve the problems of complicated manufacturing process, position deviation of adhesive film and semiconductor chip, complicated manufacturing process, etc.
CN1348208AInactive Publication Date: 2002-05-08KK TOSHIBA
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
KK TOSHIBA
Publication Date
2002-05-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor wafer on which elements have been formed is diced and a rear surface of the semiconductor wafer is ground by a dicing before grinding method to form discrete semiconductor chips. The discrete semiconductor chips are adhered to an adhesive film and then the surface of the adhesive film is removably affixed to a dicing tape. After this, any excess portions of the adhesive film disposed between the respective semiconductor chips are removed.
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Description

technical field

[0001] The present invention relates to a method of manufacturing a semiconductor device, and more particularly to a method of manufacturing a semiconductor device applicable to a semiconductor chip manufacturing process in which a film-like die-bonding agent is attached to a semiconductor chip thinned and separated by a pre-slicing method. Background technique

[0002] In order to simplify the process of pressure-mounting a semiconductor chip (chip component) on a metal frame or an organic substrate, a film-shaped die-bonding agent, that is, a semiconductor chip with an adhesive attached, is used on the inner surface of the semiconductor chip. chip.

[0003] Currently, such adhesive-attached semiconductor chips are used as Figure 6 (a) ~ (e) shown in the process of manufacturing, that is, first, as Figure 6 As shown in (a), a film-like adhesive (adhesive film) 12 is bonded to the entire inner surface of the semiconductor wafer 11 after element formation is...

Claims

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