Method for mfg. multilayer matrix and multilayer matrix made thereby
A manufacturing method and substrate technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, layered products, etc., can solve problems such as high production costs and complicated process steps
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no. 1 example
[0068] Hereinafter, the embodiments will be explained with reference to the drawings. Figures 1A to 1E The manufacturing steps of a multilayer substrate in this example are shown.
[0069] Figure 1A Among them, 21 represents a single-side conductor patterned film, which has a conductor pattern 22 formed by etching a conductor foil (copper foil thickness is 18 μm in this embodiment), and the conductor foil is adhered to a single-sided resin film 23 as an insulating base. on the side. In this embodiment, a resin film with a thickness of 25-75 μm is used as the resin film 23, which is composed of 65-35 wt% polyetheretherketone resin and 35-65 wt% polyetherimide resin. . In addition, other metal foils such as aluminum foil or the like can be used as the conductive foil.
[0070] As shown in FIG. 1, after the formation of the conductor pattern 22 is completed, a through hole 24 is formed by irradiating a carbon dioxide gas laser from one side of the resin film 23 to provide a ...
no. 2 example
[0084] Next, a second embodiment is explained with reference to the drawings.
[0085] In the second embodiment, the formation of the conductor pattern including the electrodes 32 and 37 is performed after the multilayer formation process with respect to the first embodiment. Incidentally, the same constituents as those of the first embodiment are denoted by the same reference numerals to omit explanations thereof.
[0086] Figures 2A to 2C Illustrated are the formation of conductors 22, the formation of vias 24 and their filling with conductive paste 50 and Figures 1A to 1C The fabrication process for the first embodiment shown is the same.
[0087] After filling the through hole 24 with the conductive material 50 is completed, a plurality of (two in this embodiment) one-sided conductor patterned films 21 are stacked so that each side on which the conductor pattern 22 is arranged is arranged on the lower side, and serves as a conductor foil Copper foils 61 (thickness 18 ...
no. 3 example
[0101] Next, a third embodiment will be explained with reference to the drawings.
[0102] In the third embodiment, the stacking direction of the plurality of single-sided conductor patterned films is opposite to that of the part of the single-sided conductor patterned films of the first embodiment. Incidentally, the same constituents as those of the first embodiment are denoted by the same reference numerals to omit explanations thereof.
[0103] Figures 3A to 3C Illustrated are the formation of conductors 22, the formation of vias 24 and their filling with conductive paste 50 and Figures 1A to 1C The manufacturing process is the same for the first embodiment shown.
[0104] After the completion of filling the via hole 24 with the conductive material 50, a plurality (four in this embodiment) of one-sided conductor patterned films 21, 21a and 21b are laminated. At that time, the lower two single-side conductor patterned films 21, 21b are laminated so that the side on whic...
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Abstract
Description
Claims
Application Information
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