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Parts built in module and its making method

A manufacturing method and technology of parts, applied in the field of built-in modules of parts, can solve the problems of wiring pattern restrictions, unsuitable for high-density installation, and inability to install semiconductor or circuit parts, etc.

Inactive Publication Date: 2002-08-28
TESSERA ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this structure has high reliability, the wiring pattern is limited because the through hole is used to connect the wiring patterns on different layers.
In addition, semiconductors or circuit components cannot be mounted on the through holes on the surface of the wiring board, so it is not suitable for high-density mounting.

Method used

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  • Parts built in module and its making method
  • Parts built in module and its making method
  • Parts built in module and its making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0053] figure 1 It is a sectional view of the component built-in module of Embodiment 1. exist figure 1 Among them, the component built-in module has: an electrical insulating layer 101; wiring patterns (first wiring patterns) 102a, 102b; a semiconductor 103 as an electronic component; and an inner via (first inner via) 104 made of via paste.

[0054] The electrical insulation layer 101 can be made of, for example, insulating resin, or a mixture of filler and insulating resin. When a mixture of a filler and an insulating resin is used for the electrical insulating layer 101, the coefficient of linear expansion, thermal conductivity, dielectric constant, etc. of the electrical insulating layer 101 can be easily controlled by appropriately selecting the filler and the insulating resin.

[0055] For example, alumina, magnesia, boron nitride, aluminum nitride, silicon nitride, tetrafluoroethylene (such as "Teflon" (trademark of DuPont)), and silicon oxide can be used as the fill...

Embodiment approach 2

[0063] Embodiment 2 is to manufacture figure 1An example of a method of building a module in the part shown. The materials used in the configuration of the component built-in module are the same as those described in the first embodiment. Figure 2A-Figure 2G It is a sectional view of the manufacturing method of the component built-in module of Embodiment 2 shown in order of process.

[0064] first as Figure 2A As shown, an electrically insulating layer 201 is formed. An example of a method of manufacturing the electrical insulating layer 201 is as follows. The component built-in module is made into a substrate shape, and an insulating resin or a mixture of a filler and an insulating resin or the like can be used as the electrical insulating layer 201 . In the latter case, the filler and the insulating resin are initially mixed and stirred to form a paste-like insulating resin mixture. A solvent for adjusting viscosity may also be added to the insulating resin mixture. ...

Embodiment approach 3

[0074] Embodiment 3 is an example of a method of manufacturing a component built-in module. Figure 3A-Figure 3G It is a sectional view showing the manufacturing process of the component built-in module of Embodiment 3 shown in order of process. In the same drawing, elements with the same names as in Embodiment 2 have the same configuration as Embodiment 2, are produced by the same manufacturing method, and have the same functions unless otherwise specified.

[0075] Such as Figure 3A As shown, on the electrical insulation layer 301 is attached with Figure 2A In the same via 306, a hole 308 for embedding a semiconductor is formed in advance. By forming the hole 308, when the semiconductor 303 is embedded in the electrical insulating layer 301, it becomes difficult to shift the position of the via 306.

[0076] Secondly, if Figure 3B As shown, via paste 304 is filled over via 306 .

[0077] and Figure 3A , Figure 3B The processes are parallelized, such as Figure 3...

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PUM

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Abstract

It has an electrical insulating layer 101, multi-layered first wiring patterns 102a, 102b laminated through the electrical insulating layer, at least one first inner via 104 electrically connected between the first wiring patterns in different layers, and buried in the electrical insulating layer 101 and For at least one electronic component 103 mounted on any one of the multilayer first wiring patterns, at least one path of the first inner via 104 occupies the same space as the electronic component 103 in the stacking direction of the first wiring patterns 102a and 102b. The occupied range overlaps the range, and its height is lower than that of the electronic component 103 in this direction. Since the height of the first inner passage 104 is low, the diameter of the passage can be reduced. Therefore, it is possible to provide a highly reliable component built-in module that can be mounted at a high density.

Description

technical field [0001] The present invention relates to a component built-in module in which electronic components such as semiconductors and / or circuit components are arranged inside an electrical insulating layer, and a method for manufacturing the same. Background technique [0002] In recent years, the high-density and high-functionality of circuit components are increasingly required in the trend of high performance and small size of electronic equipment. It is required to respond to high density and high functionality even in the module where circuit parts are mounted. In order to mount circuit components at a high density, the wiring pattern also becomes complicated, and there is a tendency to multilayer the wiring board at present. [0003] On a conventional glass-epoxy substrate, multilayering is performed using a through-hole structure penetrated by a drill. Although this structure has high reliability, the wiring pattern is limited becau...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H01L23/538H05K1/18H05K3/46
CPCH01L23/5389H01L2224/16225H01L2924/01025H01L2924/01046H01L2924/01078H01L2924/01079H01L2924/09701H01L2924/12044H05K1/187H05K3/20H05K3/4069H05K3/4602H05K3/4614H05K3/4652H05K2201/10378H01L2224/45144H01L2924/181H01L2924/19105H01L2924/00014H01L2924/00H01L2924/00012H01L2224/0401H05K1/14H05K3/46
Inventor 朝日俊行菅谷康博小松慎五中谷诚一
Owner TESSERA ADVANCED TECH