Electric connecting apparatus using resin welding flux, electric connecting apparatus and wire connecting method
An electrical connector, electrical connection technology, applied in conductive connection, welding/welding connection, connection of four or more poles, etc., can solve the problems of weak power, lack of reliability, low connection strength, etc., to achieve productivity High, good heat dissipation, the effect of reducing electrical resistance
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Embodiment 1
[0057] In 45% by volume of ABS resin (manufactured by Toray, Toyo Lak 441), 40% by volume of lead free solder (manufactured by Fukuda Metal Foil Powder Industry, Sn-Cu-Ni-AtW-150) and copper powder (Fukuda Metal Foil Powder Industry Co., Ltd., FCC-SP-77, average particle size 10 μm) 15% by volume, put into a mixer set at 220°C (Moriyama Manufacturing Co., Ltd., 2-axis pressurized type), form the heating and holding time, and use a rotation speed of 25 ~50rpm kneading for 20 minutes, the heat-plasticized solder is dispersed in the resin in a semi-molten state.
[0058] The kneaded body was granulated with a plunger extrusion granulator (TP60-2 type manufactured by Toshin) at a mold temperature of 200-240° C. to produce granules. The pellets were injection-molded in a mold (mold temperature normal temperature to 150° C.) with an injection molding machine (KS-10B manufactured by Kawaguchi Steel Co., Ltd.) at a set temperature of 230 to 280° C. The resulting injection molded prod...
Embodiment 2
[0061] 40% by volume of lead free solder (manufactured by Fukuda Metal Foil Powder Co., Ltd., Sn-Cu-Ni-AtW-150) and copper powder (manufactured by Fukuda Metal Foil Powder Co., Ltd. , FCC-SP-77, average particle size 10μm) 15% by volume, put it into a kneader (Moriyama Manufacturing Co. Do not raise the temperature of the kneading body above 235°C, reduce the speed, cool it, etc., knead for 20 minutes to make it heat-plasticized, and disperse the solder in the resin in a semi-molten state. The dispersion state of the solder in the kneaded body was observed with an optical microscope, and the solder was uniformly dispersed in the resin with a size of about 5 μm.
Embodiment 3
[0063] In 35% by volume of ABS resin (manufactured by Toray, Toyo Carat 441), 55% by volume of lead free solder (manufactured by Fukuda Metal Foil Powder Industry, Sn-Cu-Ni-AtW-150) and copper powder (Fukuda Metal Manufactured by Foil Powder Industry, FCC-SP-77, average particle size: 10 μm) 10% by volume, the total metal component is set to 65% by volume, and the mixture is put into a kneader set at 220°C (manufactured by Moriyama Seisakusho, 2 shafts Pressurized type) to form a heating holding time, kneading with a rotation speed of 25-50rpm for 20 minutes to make it thermally plasticized, and disperse the solder in the resin in a semi-molten state.
[0064] The kneaded body is granulated in a plunger extrusion granulator (TP60-2 type manufactured by Dongshin) with a mold temperature of 200-240°C to make granules. Using the pellets, injection molding was performed in a mold (mold temperature, normal temperature 150° C.) with an injection molding machine (KS-10B manufactured ...
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