Integrated module board with embedded IC chip and passive element and its production method

Abstract

The integration type module board includes following parts. The base plate contains the multiple large openings and the small opening where the passive component is positioned in. The first adhesive glue film adhibits the bottom of the base palte to the heat sink base plate to form the integration type module board. The IC chip is adhibited in the large opening of the module board by use of the second adhesive glue film. The dielectric packed layer covers the whole surface of the module board and fills in the all gaps on the surface of the module board.

Description

technical field [0001] The present invention relates to an integrated modular board (moduled board) and its manufacturing method, in particular to a plastic solder ball array (Cavity-Down Plastic Ball Grid Array, CD-PBGA) with openings downwards or containing various openings The modularized substrate and its manufacturing method can integrate various IC chips and various passive components in the modularized substrate. Background technique [0002] Electronic assembly includes bonding and fixing of integrated circuit (IC) chips, circuit wiring, structural sealing, bonding with circuit boards, system assembly, and all processes between product completion. The purpose is to combine and complete IC chips and necessary Circuit components, in order to realize the functions of transmitting electric energy and circuit signals, providing heat dissipation channels, load bearing and structural protection, etc. [0003] Generally speaking, electronic packaging...

AI Technical Summary

Problems solved by technology

[0005] The existing process will encounter the following problems: First, steps such as IC chip packaging process, passive component assembly process, and surface mount technology (SMT) must be carried out separately, so the overall product is superior due to the long process The rate is low, and the cost of the packaging process is extremely high

Second, without the integration of passive component assembly and SMT process, the thickness of the entire product cannot be reduced, which cannot meet the trend of "light, thin, short, and small" of current technology

Third, in order to achieve the heat dissipation effect, an additional heat sink / fan element and an electromagnetic wave interference (Electro-Magnetic Interference, EMI) shielding plate must be provided on the motherboard to improve electrical performance, which will further Increase overall process cost

Fourth, since IC chips, passive components and heat dissipation components cannot be integrated on the substrate at the same time, the layout circuit lines of the product are too long, which affects its electrical quality

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