Laser hole-making method for non-metal thin type material and its equipment

A thin material, non-metallic technology, applied in the field of laser drilling of non-metallic thin materials, can solve the problems of not having a good drilling method and equipment, and achieve the effect of consistent pattern, flexible layout and simple equipment

Inactive Publication Date: 2003-04-23
HUAZHONG UNIV OF SCI & TECH +1
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  • Abstract
  • Description
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Problems solved by technology

For thicker thin materials, such as cloth, fiber fabrics; non-bendable thin materials, such as organic plastic sheets; viscous thi

Method used

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  • Laser hole-making method for non-metal thin type material and its equipment
  • Laser hole-making method for non-metal thin type material and its equipment
  • Laser hole-making method for non-metal thin type material and its equipment

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Experimental program
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Embodiment Construction

[0025] The method of the present invention selects the hole-making method of punching or cutting holes according to the hole-making requirements; and by setting the program parameters of the control device, the control device controls the laser power, and adjusts the size of the hole by controlling the movement track of the beam deflection system , density and pattern.

[0026] During dynamic hole making, the position of the hole is dynamically changed due to the continuous movement of the material. In order to ensure that the hole making pattern is consistent when the material is moving at different speeds, the method of online detection of the displacement and moving speed of the material is adopted. According to the detected material displacement, the displacement compensation amount is calculated in real time, and the beam deflection system for hole making is dynamically compensated and corrected; and according to the detected material movement speed, the hole making device...

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Abstract

The laser boring method of non-metal thin-type material includes the following processes: according to the requirements selecting boring mode, setting program parameters of control device to control laser power, utilizing movement pathway of bean-deflecting system to regulate bore size, density and pattern, on-line detecting movement speed of machined material to transfer it into computer, makingreal-time computing compensation and making compensation correction to implement laser boring process. Its equipment includes laser and mater running device, beam-deflecting sytem, control device, speed sensor and borning device, etc.

Description

technical field [0001] The invention belongs to laser processing technology, and in particular relates to a method and equipment for laser hole making of non-metallic thin material. It uses a CO2 laser beam that can be deflected by a galvanometer scanning system to form a through hole through local vaporization on a continuously moving wide or narrow non-metal thin material. The through holes are evenly distributed or arranged in a pattern, and the hole diameter and density are adjustable. Background technique [0002] As a new processing method, laser processing is being widely used in various production departments due to its advantages of energy concentration and non-contact mode of action. For the hole making of high hardness materials or other special materials, laser hole making is an effective way. Laser drilling can be divided into laser drilling and cutting. Punching means that when the laser interacts with the material, its point of action is still relative to t...

Claims

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Application Information

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IPC IPC(8): B23K26/08B23K26/382
Inventor 汪盛烈陈世全杨海杨义厚王晓东闵志浩何云贵乐仁汉赵学明张忠国李敦明
Owner HUAZHONG UNIV OF SCI & TECH
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