Packaging method for short wavelength LED

A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as product life impact, thermal stress reduction, and epoxy resin's inability to withstand UV light.
CN1424772AInactive Publication Date: 2003-06-18SOLIDLITE CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SOLIDLITE CORP
Publication Date
2003-06-18
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for packaging the short-wavelength LED includes coating a layer of liquid-state inorganic glass resin on the LED crystal cell and then pouring epoxy resin for packaging it. It can prevent the external epoxy resin layer from being poor under the action of high temp and short wavelength radiation, so improving the brightness and service life.
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Description

technical field

[0001] The invention provides a light emitting diode packaging method, in particular to a short wavelength light emitting diode packaging method. Background technique

[0002] At present, traditional light-emitting diode (LED) packaging is based on direct casting of LED die, epoxy resin and bracket or substrate. figure 1 "Or Molding (Molding) molding method packaging" refer to figure 2 ", but the epoxy resin is easily affected by the heat source on the surface of the LED die, resulting in deterioration, which not only reduces the brightness of the LED, but also shortens the life of the LED.

[0003] In recent years, short-wavelength light-emitting diodes are gradually being developed, especially LED grains with light wavelengths between 360-410nm (near UV light). Epoxy glue) package. Since the epoxy resin is not resistant to UV light, so that the deterioration makes the life of the LED worse, so far there is no epoxy resin that can withstand UV light. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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