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Packaging method for short wavelength LED

A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as product life impact, thermal stress reduction, and epoxy resin's inability to withstand UV light.

Inactive Publication Date: 2003-06-18
SOLIDLITE CORP
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Problems solved by technology

Since the epoxy resin is not resistant to UV light, the deterioration makes the life of the LED worse. So far, there is no epoxy resin that can withstand UV light.
[0004] In addition, a layer of silica gel is first coated on the surface of the LED grain and then encapsulated with glue, "see image 3 "Or die-casting packaging, the softer silicone is to buffer the heat source on the surface of the epoxy resin and the LED die to reduce the thermal stress response, but it still cannot resist the erosion of short-wavelength UV light below 400nm, making the silicone Or the epoxy resin deteriorates, and the product life is greatly affected

Method used

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  • Packaging method for short wavelength LED
  • Packaging method for short wavelength LED
  • Packaging method for short wavelength LED

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Embodiment Construction

[0019] Generally, LED sealant is made of organic materials, which cannot withstand high temperature and ultraviolet light. Silicone can withstand high temperature of about 200°C, and it is also unable to withstand ultraviolet light. The "liquid glass glue" used in the present invention is different from ordinary glass that needs to be heated to be liquid. It is a liquid colloid at room temperature, which can be applied by dispensing or coating, and becomes a solid glass after heating and hardening. , whose main component is silicon dioxide (SiO 2 ). At present, there are two kinds of liquid glass, one is water glass (Water Glass), the main component is Na 2 o 2 , SiO 2 , another kind of liquid glass (Heatless Glass) invented by the Japanese without heating, the main component is silicon dioxide (SiO 2 ), silicon dioxide is an inorganic glass material with high temperature resistance and short wavelength UV resistance.

[0020] "Short-wavelength light-emitting diode packag...

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Abstract

A method for packaging the short-wavelength LED includes coating a layer of liquid-state inorganic glass resin on the LED crystal cell and then pouring epoxy resin for packaging it. It can prevent the external epoxy resin layer from being poor under the action of high temp and short wavelength radiation, so improving the brightness and service life.

Description

technical field [0001] The invention provides a light emitting diode packaging method, in particular to a short wavelength light emitting diode packaging method. Background technique [0002] At present, traditional light-emitting diode (LED) packaging is based on direct casting of LED die, epoxy resin and bracket or substrate. figure 1 "Or Molding (Molding) molding method packaging" refer to figure 2 ", but the epoxy resin is easily affected by the heat source on the surface of the LED die, resulting in deterioration, which not only reduces the brightness of the LED, but also shortens the life of the LED. [0003] In recent years, short-wavelength light-emitting diodes are gradually being developed, especially LED grains with light wavelengths between 360-410nm (near UV light). Epoxy glue) package. Since the epoxy resin is not resistant to UV light, so that the deterioration makes the life of the LED worse, so far there is no epoxy resin that can withstand UV light. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 陈兴
Owner SOLIDLITE CORP
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