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Laser cutting method for printed circuit board and working equipment

A printed circuit board and laser cutting technology, which is applied in laser welding equipment, metal processing equipment, printed circuit components, etc., can solve the problems of complicated process, long cycle, exhaust gas environmental pollution, etc., and achieve the goal of overcoming complicated process and easy absorption Effect

Inactive Publication Date: 2003-10-22
徐建平
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has complicated process and long cycle, and improper treatment of waste gas and liquid can easily cause environmental pollution.

Method used

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  • Laser cutting method for printed circuit board and working equipment
  • Laser cutting method for printed circuit board and working equipment
  • Laser cutting method for printed circuit board and working equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The processing equipment of the present invention is mainly composed of a frame 1, a longitudinal movement mechanism with a crossbeam 23 placed on the top of the frame 1, a transverse movement mechanism with a YG laser 16 placed on the crossbeam 23, and the like.

[0019] The longitudinal movement mechanism includes two longitudinal guide rails 21 with longitudinal sliders 24 placed on the frame 1 and longitudinal screw rods 22 with longitudinal motors 31, etc., and the crossbeam 23 is placed between the longitudinal sliders 24, and the middle part is provided with longitudinal A longitudinal nut 25 with a longitudinal nut seat 26 engaged by the threaded mandrel 22 , the longitudinal threaded mandrel 22 is rigidly connected with the frame 1 through two bearing seats 27 . Rotate the longitudinal motor 31 installed on the frame 1, through the transmission of the longitudinal driving gear 30, the synchronous belt 29, and the longitudinal passive gear 28, the longitudinal sc...

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Abstract

The present invention relates to a method for laser cutting printed circuit board and its working equipment, and is characterized by that it utilizes the laser sent by YG laser to form high-energy laser beam after the laser is focussed, and makes the high-energy laser beam be projected on the copper sheet of broad blank of the printed circuit board and makes the copper sheet quickly melt and oxidate so as to implement cutting. Its working equipment mainly is formed from machine frame, longitudinal moving mechanism containing longitudinal screw rod and longitudinal nut and transverse moving mechanism containing transverse screw rod and transverse nut. Said invention can make YG laser implement straight line motion with different slope and curved motion with different curvatures so as to can make predefined cutting.

Description

technical field [0001] The invention relates to a laser cutting method and processing equipment for a printed circuit board, and belongs to the technical field of laser cutting in printed circuit boards. Background technique [0002] With the rapid development of electronic technology and market situation, printed circuit boards, one of the main components of electronic products, are updated very quickly, especially in the development and trial production stages of new products, and several sets of plans are put into test at the same time, so the printed circuit boards The production puts forward high-quality, fast and convenient requirements. [0003] At present, the general method of making printed circuit boards is to issue a black and white film (negative film) on a laser phototypesetting machine according to the drawn design pattern, and cover the film on a slab coated with photosensitive adhesive for exposure and cleaning to form a layer of pattern...

Claims

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Application Information

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IPC IPC(8): B23K26/38H05K1/02
Inventor 徐建平
Owner 徐建平
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