Manufacturing method of base plate material for electron device
A technology for electronic devices and manufacturing methods, which is applied to electric solid devices, electrical components, semiconductor devices, etc., can solve problems affecting the consistency of thermal expansion coefficient performance, uneven material composition, performance degradation, etc., to ensure air tightness and thermal conductivity. Conductive performance, simple process and small difference in composition
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Embodiment 1
[0018] Example 1: Preparation of W-15Cu substrate material
[0019] Put the industrial tungsten powder with a Fischer grain size of 4.1 μm in a molybdenum wire furnace and treat it at 1200°C for 1 hour under a wet hydrogen atmosphere; the treated tungsten powder is directly pressed into a green body of 75×50×4mm under a pressure of 915MPa. Its density is 72.46% T.D. without adding any plasticizer and lubricant.
[0020] Then pre-fire the green body in hydrogen at 1200°C for 1 hour to remove oil, water vapor, and reduce residual oxides; then place a copper block of corresponding weight under the green body, raise the temperature to 1350°C, and use hydrogen as a protective atmosphere to keep warm After 1 hour, the W-15Cu heat dissipation substrate material is obtained after cooling.
[0021] After testing, the material contains 85% tungsten and 15% copper. Its performance indicators are listed in Table 1.
[0022] It can be seen that the tungsten copper or molybdenum copper m...
Embodiment 2
[0023] Embodiment 2: Preparation of Mo-15Cu substrate material
[0024] The industrial molybdenum powder with a Fischer particle size of 2.0 μm was treated in a wet hydrogen atmosphere at 900°C for 40 minutes; the treated molybdenum powder was directly pressed into a Φ50×4mm green body with a pressure of 700MPa without adding any plasticizer and Lubricant, available with a green density of 83.27% T.D.
[0025] Pre-burn the green body at 1000°C in dry hydrogen to remove oil, water vapor, and reduce residual oxides; then place a copper block of corresponding weight under the green body, raise the temperature to 1350°C, and the protective atmosphere is a mixture of nitrogen and hydrogen Gas (nitrogen 25vol.%, hydrogen 75vol.%), heat preservation for 1 hour, and after cooling, the Mo-15Cu heat dissipation substrate material can be obtained.
[0026] Material
[0027] After testing, the material contains 85% molybdenum and 15% copper. Its performance indicators are sho...
Embodiment 3
[0028] Example 3: Preparation of W-10Cu
[0029] The industrial tungsten powder with a Fischer particle size of 4.1 μm was treated in a molybdenum wire furnace at 1300°C for 2 hours under a wet hydrogen atmosphere; after the treatment, the tungsten powder was directly pressed into a green body of 23×10×3mm under a pressure of 1800MPa; The green density is 80.69% T.D., without adding any plasticizer and lubricant;
[0030] Preheat the green body at 1200°C in dry hydrogen to remove oil, water vapor, and reduce residual oxides; then place a copper block of corresponding weight under the green body, raise the temperature to 1350°C, and keep the temperature for 1 hour in a vacuum protective atmosphere , After cooling, the W-10Cu heat dissipation substrate material can be obtained.
[0031] After testing, the material contains 90% tungsten and 10% copper. Its performance indicators are also listed in Table 1.
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