Structure of for preparing gate containing nitrogen in silicon oxide layer of semiconductor device and preparation technique

A gate silicon oxide, manufacturing process technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc.

Inactive Publication Date: 2004-10-27
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The thin gate silicon oxide prepared by this method can not only effectively solve the problem of boron (B) penetration, but also enhance the reliability of the thin gate oxide layer and reduce its leakage cur

Method used

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  • Structure of for preparing gate containing nitrogen in silicon oxide layer of semiconductor device and preparation technique
  • Structure of for preparing gate containing nitrogen in silicon oxide layer of semiconductor device and preparation technique

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] With rapid annealing oven (RTO), under normal pressure or reduced pressure

[0021] 1. In NO gas, at a temperature of 1000° C., grow a thin layer of silicon oxynitride (SiON) on the surface of a clean silicon wafer with a thickness of 8 Å.

[0022] 2. Turn off the NO gas and replace it with pure oxygen (O 2 ) gas, in this pure oxygen gas, the silicon wafer is further oxidized, that is, a thin silicon oxide (SiO) layer is grown under the newly grown SiON film, and its thickness is about 15 Å;

[0023] 3. Close O 2 Gas, then use NO gas, and anneal in this NO gas, so that a small amount of N in the NO gas diffuses to the interface between silicon oxide and silicon, forming a thin SiON interface layer with a thickness of about 3 Å;

[0024] 4. In order to further improve the quality of this gate silicon oxide, turn off the NO gas and replace it with O 2 Gas, so that the gate silicon oxide grown on it is further in O 2 Annealing in the gas for 30 seconds pushes the N ele...

Embodiment 2

[0026] 1. Using a rapid annealing furnace (RTO), under normal pressure or reduced pressure, in NO gas, at a temperature of 800°C, grow a layer of SiON on a silicon wafer with a thickness of 5 Å.

[0027] 2. Turn off the NO gas and replace it with O 2 gas to further oxidize the silicon wafer, and grow a layer of SiO under SiON with a thickness of 3 Å;

[0028] 3. Close O 2 Gas, and then replaced with NO gas, annealed in NO gas to form a SiON interface layer with a thickness of 7 Å;

[0029] 4. Turn off the NO gas and replace it with O 2 Gas, the grown gate silicon oxide will be further in O 2 Annealing in the gas for 10 seconds pushes the N element distributed on the silicon oxide-silicon interface away from the silicon surface by about 5 Å.

Embodiment 3

[0031] 1. Using a rapid annealing furnace (RTO), under normal pressure or reduced pressure, in NO gas, at a temperature of 1100°C, grow a layer of SiON on a silicon wafer with a thickness of 20 Å.

[0032] 2. Turn off the NO gas and replace it with pure oxygen gas, and grow a layer of SiO under the grown SiON film in oxygen, with a thickness of 10 Å;

[0033] 3. Close O 2 Gas, and then replaced with NO gas, annealed in NO gas, so that a small amount of NO gas diffuses to the interface between silicon oxide and silicon, forming a SiON interface layer with a thickness of 10 Å;

[0034] 4. Turn off the NO gas and replace it with O 2 or N 2 gas, making the gate silicon oxide further in O 2 or N 2 Annealing in the gas for 50 seconds pushes the N element distributed on the silicon oxide-silicon interface away from the silicon surface by about 3 Å.

[0035] The nitrogen-containing gate silicon oxide layer prepared by the above-mentioned embodiments has good performance, which ca...

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Abstract

Technique of preparing gate silicon oxide layer is key technique of fabricating IC. A small quantity of nitrogen element doped into traditional gate silicon oxide improves its characteristics. Rapid tempering oven (RTO) is adopted in the invention to control diffusibility of element accurately. Thickness of silicon oxide layer and distribution of nitrogen element are controlled through methods of multistep oxidation and annealing (diffusing). The preparing method solves issues of boron penetration, raises reliability, reduces leakage current, and does not effect on carrier mobility in channel obviously.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit manufacturing technology, and in particular relates to a nitrogen-containing gate silicon oxide layer structure of a semiconductor device and a manufacturing technology thereof. Background technique [0002] The preparation process of the gate silicon oxide layer is a key process technology in the integrated circuit manufacturing process, which directly affects and determines the electrical characteristics and reliability of the device, especially in the deep submicron integrated circuit manufacturing process, because the gate silicon oxide layer becomes Thinner and thinner, approaching or even working at its physical limit value, it will face many challenges, mainly in the following two aspects: (1) the electrical breakdown reliability and leakage current of thin gate silicon oxide, and the direct tunneling current problem; (2) The problem of boron penetration (Bpenetration) from P+ po...

Claims

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Application Information

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IPC IPC(8): H01L21/285H01L21/336H01L21/8234H01L29/78
Inventor 陈寿面
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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