Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection

A technology of imide resin and polyurethane, applied in the direction of polyurea/polyurethane adhesive, adhesive type, conductive adhesive, etc., can solve the problems of productivity, unfavorable cost, complicated process, etc., and achieve adhesiveness Excellent, improved adhesion reliability, and excellent connection reliability

Inactive Publication Date: 2005-07-13
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the underfill implantation process complicates the pro

Method used

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  • Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection
  • Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection
  • Polyurethane-imide resin, adhesive composition and adhesive composition for circuit connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0111] In 1-methyl-2-pyrrolidone, diphenylmethane-4,4'-diisocyanate (1.0mol), diphenylmethane-2,4'-diisocyanate ( 1.0mol) and polytetramethylene glycol (0.8mol) with an average molecular weight of 1000 were reacted for 1 hour, and 4,4'-hydroxyphthalic anhydride (1.0mol), triethylamine and 1-methyl-2 - pyrrolidone, further stirring at 100° C. for 3 hours. Further, benzyl alcohol was added, and the mixture was stirred at 100°C for 1 hour to complete the reaction. The obtained solution was put into vigorously stirred water, the precipitate was filtered, and dried in vacuum at 80° C. for 8 hours to obtain polyurethane-imide resin PUI-1. As a result of measuring the obtained polyurethane-imide resin by GPC (gel permeation chromatography), Mw=51000 and Mn=22000 in terms of polystyrene. In addition, this urethane-imide resin was soluble in methyl ethyl ketone at a solid content of 40% by weight.

[0112] The obtained polyurethane-imide resin was dissolved in methyl ethyl ketone wi...

Embodiment 2

[0114] The diol component of PUI-1 was changed to poly(hexamethylene carbonate) having an average molecular weight of 2000, and synthesized in the same manner as in Example 1 to obtain PUI-2. As a result of measurement by GPC, Mw=55000 and Mn=25000 in terms of polystyrene.

[0115] This PUI-2 was formulated in accordance with Table 1 in the same manner as in Example 1 to obtain a film-like adhesive having a thickness of the adhesive layer of 20 μm.

Embodiment 3

[0117] The glycol component of PUI-1 is changed into the polytetramethylene glycol (0.4mol) that the average molecular weight is 1000, the poly(hexamethylene carbonate) (0.4mol) that the average molecular weight is 2000, synthesizes in the same way as Example 1 , get PUI-3. As a result of measurement by GPC, Mw=55000 and Mn=25000 in terms of polystyrene. In addition, this polyurethane imide resin was soluble in methyl ethyl ketone at a solid content of 40% by weight.

[0118] This PUI-3 was formulated in accordance with Table 1 in the same manner as in Example 1 to obtain a film-like adhesive having an adhesive layer thickness of 20 μm.

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Abstract

To provide a polyurethane imide resin and an adhesive composition containing thereof which are excellent in the adhesive strength and are suitable for an adhesive for use in circuit-connecting or semiconductor-mounting. Said polyurethane imide resin is expressed by general formula (1) (wherein, R1is a divalent organic group containing an aromatic ring or an aliphatic ring; R2 is a divalent organic group having a molecular weight of 100-10,000; R3 is a tetravalent organic group containing 4 or more carbon atoms; and n and m are each an integer of 1-100).

Description

technical field [0001] The present invention relates to a polyurethane-imide resin, an adhesive composition using the polyurethane-imide resin, and an adhesive composition for circuit connection using the adhesive composition. Background technique [0002] Organic materials such as epoxy resins are often used in the semiconductor field. In the field of packaging materials, 90% or more of packaging systems are being replaced with resin packaging systems. The packaging material is a composite material composed of epoxy resin, curing agent, various additives, inorganic fillers, etc., and cresol novolac epoxy resin is often used as the epoxy resin. However, the cresol novolac type epoxy resin does not have the required characteristics in terms of satisfying characteristics such as low water absorption and low modulus of elasticity, so it is difficult to cope with the surface mount method. For this reason, many novel and high-performance epoxy resins that replace cresol novolac...

Claims

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Application Information

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IPC IPC(8): C08G61/12C08G18/34C08G18/83C08G73/06C08G73/10C09J175/04C09J179/08
CPCC08G61/12C08G73/06C08K2201/001C09J9/02C09J11/00C09J163/00C09J175/04C09J179/08
Inventor 杉浦实汤佐正己
Owner HITACHI CHEM CO LTD
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