Exposure device

Abstract

This invention relates to an exposure exposal device, is applied to put the figures that need to be exposed to the sensitive components on the exposure platform and the get large area of figures with the nanometer line width and accuracy. It is composed of the complete appliance frame, the damping system, the accurate movement system, the precision measure system, the alignment system, the precision exposure system and driving electrical system. The complete appliance frame is divided by the damper into the internal frame and the external frame, the driving electrical device is fixed on the external frame. This invention mainly solves the problem of bad damping performance of present technology, and can improve the exposal precision of the device to the level of nanometer exposure.

Description

technical field [0001] The invention relates to an exposure device, which is used for projecting a pattern to be exposed onto a photosensitive element on an exposure platform according to a certain ratio, so as to obtain a large-area pattern with a certain steepness of nanometer line width and precision. Background technique [0002] In VLSI optical lithography, the main factor that determines the thinnest line width of fine patterns is the lithography work resolution of the lithography equipment, and the vibration of the whole machine is one of the key factors affecting the lithography resolution. With the improvement of the integration of large-scale integrated circuit devices, the requirements for the resolution of lithography work are getting higher and higher, that is, the stability of the exposure system of the lithography machine, the accuracy of the measurement system and the precision of the motion platform are also getting higher and higher. (At present, the positi...

AI Technical Summary

Problems solved by technology

[0005] (1) The wafer reticle alignment system, exposure system, and measurement system are all at the level of non-vibration reduction or passive vibration reduction, which makes it easy for vibration to be transmitted to the inside of the system, affecting measurement accuracy and exposure accuracy

In addition, the mask transport, driving motor and shutter are placed directly on the passive vibration-damping airbag, which causes a lot of vibration inside the device, so the structure is unreasonable

[0006] (2) Due to the use of passive airbags and air bearings for vibration reduction, only the vibration caused by the outside can be weakened, and there is not much effect on the internal vibration, so the internal vibration has an impact on the accuracy of the workpiece table, mask table, exposure system and alignment system great influence

[0008] (4) The mask pre-alignment stage and silicon wafer pre-alignment stage are outside the vibration reduction system. The mask plate and silicon wafer are completely positioned mechanically, so the positioning accuracy is not high. The aligned mask plate and silicon wafer are transferred to There is also a large error between the plate holder and the exposure table

Images