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A method for preparing silver plated copper powder

A technology of silver-plated copper powder and copper powder, which is applied in the direction of liquid chemical plating, coating, metal material coating process, etc., can solve the problems of hindering replacement reaction, waste of silver, and low silver content on the surface, so as to save consumption, Uniform distribution of silver on the surface and smooth surface

Inactive Publication Date: 2005-12-07
GUILIN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The literature "Study on the Mechanism of Silver Plating Reaction of Micron Copper Powder with Silver-Ammonia Solution" ("Journal of Inorganic Chemistry", No. 16, 2000) points out that when silver-ammonia solution is used to prepare silver-plated copper powder, copper replaces Ag + Generated Cu 2+ with NH 3 Generate [Cu(NH 3 ) 4 ] 2+ , which is adsorbed on the surface of copper powder to prevent the replacement reaction from proceeding. Therefore, only a dotted coating can be obtained after one silver plating reaction. The silver content on the surface is low, does not have room temperature oxidation resistance, and causes a lot of waste of silver.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: prepare 0.025mol / L containing 0.316gAgNO in a container 3 The solution was slowly added dropwise with ammonia water under stirring until the precipitate formed earlier just dissolved completely and became a transparent solution. Press V in another container (RE608) V (煤油) = Dilute RE608 in a ratio of 1:2.5. Mix 40mL of diluted RE608 with silver ammonia solution, heat to 80°C, add 2g of self-made copper powder with an average diameter of 3m to the mixture under stirring, and react for 20min. Wash the prepared powder three times with kerosene, once with acetone, once with a mixed solution of dilute sulfuric acid and ethanol under heating conditions, and finally with water twice, and dry in a vacuum oven at 80°C to obtain the obtained powder. Silver-plated copper powder is required. The surface of the silver-plated copper powder is smooth, the surface layer of silver is evenly distributed, and its contact resistance value is 0.3Ω (the internal resistance ...

Embodiment 2

[0014] Embodiment 2: prepare 0.025mol / L containing 0.316gAgNO in a container 3 The solution was slowly added dropwise with ammonia water under stirring until the precipitate formed earlier just dissolved completely and became a transparent solution. In another container, mix α-benzidine glycol oxime with CHCl 3 Diphenylglycoxime was diluted in a ratio of 1:1 by volume. Mix 20mL of diluted benzidine and silver ammonia solution, heat to 40°C, add 3g of self-made copper powder with an average diameter of 3m to the mixture under stirring, and react for 15min. The prepared powder is washed twice with acetone, then washed once with a mixed solution of dilute sulfuric acid and ethanol under heating conditions, and finally washed twice with water, and dried in a vacuum oven at 80°C to obtain the required silver-plated copper. pink. The contact resistance value of this silver-plated copper powder is the same as embodiment 1.

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Abstract

The invention relates to a process for preparing silver-plated copper powder, which comprises using chelation extracting agent during the silver-plated copper powder production from silver ammonia solution, obtaining cheliform compounds with the obtained Cu2++ and loading into organic phase. The silver-plated copper powder have high oxidization resistance under normal temperature.

Description

technical field [0001] The invention relates to a preparation method of silver-plated copper powder. Background technique [0002] With the rapid development of the electronics industry and the increasing popularity of communication equipment and various commercial and household electronic products, the hazards of electromagnetic radiation are becoming more and more serious. In order to improve the performance and competitiveness of electronic products and improve the living environment of human beings, it is imperative to take anti-jamming measures. Using electromagnetic shielding conductive coatings to shield electromagnetic waves is an effective and economical method. Conductive fillers are an important part of conductive coatings, and their performance, shape and particle size distribution directly affect the conductivity of electromagnetic shielding conductive coatings. Thus affecting its shielding effect. [0003] Silver-based conductive filler is the earliest conduc...

Claims

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Application Information

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IPC IPC(8): C23C18/16
Inventor 曹晓国吴伯麟
Owner GUILIN UNIVERSITY OF TECHNOLOGY
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