End effector assembly for supporting substrates

Abstract

Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for supporting a quadrilateral substrate during substrate transfer includes an end effector having an inner edge support disposed on a first end and a first outer edge support disposed on a distal end. The first end of the end effector is adapted for coupling to a robot linkage. The first inner edge support has a face that is oriented parallel to and facing the face of the first outer edge support. This configuration of edge supports captures the substrate to the end effector thereby minimizing substrate slippage during transfer. In another embodiment, lateral guides may be utilized to further enhance capturing the substrate along the edges of the substrate open between the inner and outer edge supports.

Description

technical field [0001] Embodiments of the present invention relate to an end effector assembly for supporting a substrate. Background technique [0002] Thin film transistors (TFTs) are traditionally fabricated on large glass substrates or panels for use in monitors, flat panel displays, solar cells, personal digital assistants (PDAs), mobile phones, and similar products. TFTs are fabricated in a cluster tool by sequential deposition of different layers in a vacuum chamber, including amorphous silicon, doped and undoped silicon oxide, silicon nitride and the like, In this case, the vacuum chamber is arranged around a central conveying chamber. Fabrication of good quality polysilicon precursors used in these structures must control the hydrogen content of the film to less than 1%. In order to achieve this low hydrogen content, the post-deposition heat treatment of the film must be performed at a temperature of about 550°C. [0003] Therefore, the robotic arms used to move ...

AI Technical Summary

Problems solved by technology

Rubber pads that melt away and stick to the back of the substrate are undesirable as it becomes a potential contamination and a problem for subsequent disposal

In addition, when the rubber pad is removed from the end effector, it can happen that the end effector scratches the backside of the substrate, which can lead to particle generation and damage or breakage of the substrate

In addition, if the rubber pad melts away, it is difficult to replace the rubber pad

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