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Sn-Ag-Cu-Cr alloy lead-free solder preparation method

A technology of lead-free solder, sn-ag-cu-cr, applied in the field of preparation in the field of soldering technology, can solve the problems of easy oxidation, high melting point, difficult melting, etc., and achieve corrosion reduction, chemical composition and metallographic structure Uniform, easy-to-step results

Inactive Publication Date: 2006-02-08
北京艾达方航空航天材料与设备研发中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the Cr element in the new lead-free solder of the Sn-Ag-Cu-Cr alloy has a melting point as high as 1857°C and is easily oxidized, it is difficult to form an alloy with metals Sn, Ag, and Cu by the usual method, and the melting is difficult

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The composition and mass percentage of the material of the invention are as follows: 0.005% of Cr, 5% of Ag, 0% of Cu, and the balance of Sn.

[0019] (1) Preparation of master alloy Sn-Cr

[0020] ①According to the composition requirements of the Sn-Ag-Cr alloy solder with Cr being 0.005%, Ag being 5%, Cu being 0%, and the balance being Sn, first weigh bulk, granular or powdered pure metal Cr and Sn respectively, and At room temperature, all of the Cr raw material and the Sn raw material having the same weight as the Cr raw material were thoroughly mixed.

[0021] ②Under vacuum conditions, raise the temperature above the melting point of metal Cr, that is, control it within the range of 1857°C, keep it warm for 30 minutes after melting, and stir thoroughly.

[0022] ③Put the remaining Sn raw materials into the furnace, and after melting, lower the temperature to 800°C and keep it warm for 60 minutes while continuing to stir. At this point, the intermediate smelting o...

Embodiment 2

[0029] The composition and mass percentage of the material of the invention are as follows: 0.5% of Cr, 0% of Ag, 2% of Cu, and the balance of Sn.

[0030] (1) Preparation of master alloy Sn-Cr

[0031] ①According to the composition requirements of the Sn-Cu-Cr alloy solder with Cr being 0.5%, Ag being 0%, Cu being 2%, and the balance being Sn, first weigh bulk, granular or powdered pure metal Cr and Sn respectively, and At room temperature, all of the Cr raw material and the Sn raw material having the same weight as the Cr raw material were thoroughly mixed.

[0032] ②Under the protective atmosphere of argon, raise the temperature above the melting point of metal Cr, that is, control it within the range of 2100°C, keep it warm for 30 minutes after melting, and stir thoroughly.

[0033] ③Put the remaining Sn raw materials into the furnace, and after melting, lower the temperature to 800°C and keep it warm for 60 minutes while continuing to stir. At this point, the intermedia...

Embodiment 3

[0040] The composition and mass percentage of the material of the invention are as follows: 1% of Cr, 2.5% of Ag, 1% of Cu, and the balance of Sn.

[0041] (1) Preparation of master alloy Sn-Cr

[0042] ①According to the composition requirements of the Sn-Ag-Cu-Cr alloy solder with 1% Cr, 2.5% Ag, 1% Cu, and Sn as the balance, first weigh the bulk, granular or powdered pure metal Cr and Sn respectively. , and at room temperature, fully mix all the Cr raw materials and the Sn raw materials with the same weight as the Cr raw materials.

[0043] ②Under the condition of hydrogen protective atmosphere, raise the temperature above the melting point of metal Cr, that is, control it within the range of 1957°C, keep it warm for 30 minutes after melting, and stir thoroughly.

[0044]③Put the remaining Sn raw material into the furnace, and after it melts, lower the temperature to 800C, keep it warm for 60 minutes, and continue stirring at the same time. At this point, the intermediate ...

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Abstract

Sn-Ag-Cu-Cr alloy lead-free solder preparation method consists of, (1) preparation of Sn-Cr intermediate alloy, which consists of mixing total Cr raw material, Cr raw material and equal weight of Sn raw material, at the presence of vacuum or protective atmosphere, elevating temperature to above the fusion point of the metal Cr, melting and thermally insulating, fully stirring, charging the residue Sn raw material into the furnace, waiting for dissolution, cooling down, thermally insulating, continuing stirring simultaneously, (2) smelting of Sn--Ag-Cu-Cr alloy, which consists of charging the Ag and Cu raw material into melting Sn-Cr intermediate alloy, waiting for complete dissolution, fully stirring, thermally insulating, cooling down, thermally insulating while agitating continuously, finally cooling down to room temperature or casting as requirement, the constituents (by weight percentage) include Cr 0.005-1%, Ag 0-5%, Cu 0-2%, and balancing Sn.

Description

technical field [0001] The invention relates to a preparation method in the technical field of soldering, in particular to a preparation method of Sn-Ag-Cu-Cr alloy lead-free solder. Background technique [0002] So far, there are many types of lead-free solders that have been developed, but there are problems of one kind or another, and there are not many of them that have practical application value. Among them, the Sn-Ag-Cu ternary alloy near the eutectic composition of Sn-3.5Ag-0.75Cu has a melting point of 217°C. Compared with other lead-free solders, it has good wettability, high mechanical strength, and high It is resistant to fatigue and thermal shock and has great practical value. It is currently recognized as the most lead-free solder that can replace the traditional Sn-Pb solder, and it may become the standard lead-free solder in the future. On the other hand, the Sn-Ag-Cu solder still has some unresolved problems besides its high melting point and high price. I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00C22C1/03C22C1/06
Inventor 李明任晓雪陈熹毛大立
Owner 北京艾达方航空航天材料与设备研发中心