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Flexible laminose plate and method for manufacturing the same

A laminated board and flexible technology, applied in the field of flexible laminated boards and its manufacturing method, capable of solving problems such as unconsidered design suitable for installation purposes, etc.

Active Publication Date: 2010-10-13
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the resin composition described in Patent Document 3 can be used as a surface protection film of a semiconductor chip, an interlayer insulating film of a semiconductor package, and an interlayer insulating film of a substrate for mounting a semiconductor package. In the state of flexible characteristics, there is insufficient research on application to semiconductor mounting applications, and the same as conventional flexible laminates, the applicability of the design to mounting applications has not been considered.

Method used

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  • Flexible laminose plate and method for manufacturing the same
  • Flexible laminose plate and method for manufacturing the same
  • Flexible laminose plate and method for manufacturing the same

Examples

Experimental program
Comparison scheme
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Synthetic example 4、5

[0085] BAPP and TPE-Q were supplied and dissolved in DMAc, then PMDA was supplied, and the mixture was stirred at room temperature for about 3 hours to prepare a polyimide precursor resin solution having the composition shown in Table 1. The polyimide precursor resin solution was processed in the same manner as in Synthesis Example 1 to form a polyimide film, and its physical properties were evaluated. The results are shown in Table 1.

Synthetic example 6、7

[0087] BAPP and TPE-R were supplied and dissolved in DMAc, then PMDA was supplied, and the mixture was stirred at room temperature for about 3 hours to prepare a polyimide precursor resin solution having the composition shown in Table 1. The polyimide precursor resin solution was processed in the same manner as in Synthesis Example 1 to form a polyimide film, and its physical properties were evaluated. The results are shown in Table 1.

Synthetic example 8

[0089] BAPP was supplied and dissolved in DMAc, then PMDA and DSDA were supplied in this order, and the mixture was stirred at room temperature for about 3 hours to prepare a polyimide precursor resin solution having the composition shown in Table 1. The polyimide precursor resin solution was processed in the same manner as in Synthesis Example 1 to form a polyimide film, and its physical properties were evaluated. The results are shown in Table 1.

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PUM

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Abstract

To provide a flexible laminated board coping with mounting conditions under high temperature and high pressure while retaining characteristics possessed by the flexible laminated board. In the flexible laminated board having a metal foil on one surface or both surfaces of an insulating resin layer, the insulating resin layer comprises a plurality of layers of a polyimide resin provided with at least one high elastic modulus resin layer in contact with the metal foil of a polyimide resin with >=1*10<8>Pa storage elastic modulus at 350[deg.]C, and at least one low thermal expansion resin layer of <=20*10<-6> / K linear expansion coefficient, where the rate of thickness of the high elastic modulus layer in the insulating resin layer is in the range of 3-45%.

Description

technical field [0001] The present invention relates to a flexible laminated board and a manufacturing method thereof, in the field of electronic materials, in particular to a flexible laminated board composed of a metal foil and a polyimide insulating resin layer used for forming circuits. Background technique [0002] Polyimide films are excellent in thermal properties, insulating properties, solvent resistance, etc., and have been widely used as materials for electrical / electronic device parts such as mobile phones. In recent years, with the progress of thinning and high-functioning of mobile phones and the like, the substrates on which the machine parts materials are mounted have been changed from rigid substrates to flexible printed circuit boards. Such flexible printed circuit boards are widely used flexible laminates, and in some of the flexible laminates, adhesive resins such as epoxy resin are used in the insulating resin layer adjacent to the metal foil, and adhesi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/08B32B15/08B32B37/15B32B37/06
CPCB32B15/08B32B27/281B32B37/24B32B2037/243B32B2307/206B32B2307/51B32B2307/538
Inventor 松山浩幸竹内正彦
Owner NIPPON STEEL CHEM &MATERIAL CO LTD