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Chemical plating activating process and metal depositing process therewith

An electroless plating and active metal technology, applied in the field of electroless plating, can solve the problems of tin ion interference and complicated operation, and achieve the effect of convenient operation and simple steps.

Inactive Publication Date: 2006-03-01
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problems of tin ion interference, activation under acidic conditions, and complex operation in the traditional electroless plating activation process, the present invention provides a process for activating a non-catalytically active substrate, which is characterized in that the steps of the process are as follows :

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10

[0041] Add rhodium trichloride to the alcohol-water mixed solution containing the polymer stabilizer, the concentration of alcohol in the alcohol-water mixed solution is 50% (v / v), stir, and make an activation solution with a Rh concentration of 0.0006mol / L 10.0g MgO powder was added to the above activation solution, heated to reflux for 4h, the reduced metal Rh was deposited on the substrate, the temperature was lowered, filtered and washed with distilled water to obtain activated MgO powder containing 0.1% Rh.

[0042]Add the above-mentioned activated MgO powder into the electroless nickel plating solution, plate at 45°C until there are no more bubbles, filter, wash with distilled water until neutral, and dry at 120°C for 4 hours to obtain MgO powder coated with metallic nickel .

[0043] The type and concentration of the polymer stabilizer selected in the preparation process, the type of alcohol, and the reflux activation temperature are listed in Table 1.

[0044] ...

Embodiment 11

[0046] Add ruthenium chloride to ethylene glycol, stir, and make an activation solution with a Ru concentration of 0.001mol / L, add 10.0g Al to the above activation solution 2 o 3 powder, stirred for 24 hours, heated and refluxed for 30 minutes, the reduced metal Ru was deposited on the substrate, cooled, filtered, washed with distilled water, and activated Al containing 1% Ru was obtained. 2 o 3 powder.

[0047] Activated Al 2 o 3 Add the powder into the electroless palladium plating solution, and plate at 45°C until there are no more bubbles, filter, wash the reaction product with distilled water until it is neutral, and dry it at 120°C for 4 hours to obtain the Al plated with metal palladium. 2 o 3 powder.

Embodiment 12

[0049] Ruthenium chloride is added in the ethylene glycol-water mixed solution, the concentration of alcohol in the alcohol-water mixed solution is 40% (v / v), stirs, is made into the activation solution that Ru concentration is 0.001mol / L, adds to above-mentioned activation solution Add 10.0g Al to 2 o 3 powder, stirred for 24 hours, heated and refluxed for 30 minutes, the reduced metal Ru was deposited on the substrate, cooled, filtered, washed with distilled water, and activated Al containing 1% Ru was obtained. 2 o 3 powder.

[0050] Activated Al 2 o 3 Add the powder into the electroless palladium plating solution, and plate at 45°C until there are no more bubbles, filter, wash the reaction product with distilled water until it is neutral, and dry it at 120°C for 4 hours to obtain the Al plated with metal palladium. 2 o 3 powder.

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PUM

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Abstract

The present invention belongs to the field of chemical plating technology, and aims at solving the problems of tin ion interference, activation at acid condition, complicated operation, etc. in activating process of chemical plating. The activating process for chemical plating is to perform pre-activation treatment on the substrate without catalytic activity before the chemical plating for depositing metal. Organic alcohol reductant is utilized to reduce active metal component directly for depositing on the substrate to form catalytic activity center and metal grain growth crystal kernel. Then, the activated substrate is set directly inside the chemical plate liquid for chemical plating. Compared with traditional chemical plating activating process, the process of the present invention is simple, no tin ion interference on the activating process, activating in neutral condition and no damage to the substrate.

Description

technical field [0001] The invention relates to a novel process for activating a substrate without catalytic activity and an electroless plating method for metal deposition comprising the process, which belongs to the technical field of electroless plating. Background technique [0002] Since Brenner and Riddell of the United States proposed the method of depositing non-powdered nickel in 1947 to realize the industrial application of electroless nickel plating technology, metal technologies such as electroless nickel plating, copper, and palladium have been gradually applied to industrial production, especially after more than 50 years With the development of electroless plating, electroless plating technology has been widely used in metal deposition on non-metallic materials to obtain functional materials with special properties (chemical properties, magnetic properties, electrical properties and mechanical properties). Electroless plating refers to the use of a reducing ag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/31
Inventor 王来军文明芬李玉山杨栋宋崇立陈靖
Owner TSINGHUA UNIV
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