Substrate and method for producing same
A manufacturing method and substrate technology, applied in the direction of circuit substrate materials, printed circuit components, electrical components, etc., can solve problems such as impracticality
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Embodiment 1
[0057] The substrate of Example 1 was produced by the method described below.
[0058] An aqueous solution having a total concentration of acicular alumina particles (long axis 100 nm, aspect ratio 10) and silica particles (spherical particles, average particle diameter 20 nm) of 5% by mass was prepared. Acetic acid was added to this aqueous solution to adjust the pH to 4.5 to prepare a dispersion. In addition, the mass ratio of the acicular alumina particles and the silica particles was 3:7.
[0059] A metal plate (size 50 mm x 50 mm x 0.1 mm) formed of an alloy of Fe and Cr was prepared. The surface roughness Ra of this metal plate was 0.3 μm. In the dispersion liquid whose liquid temperature was set to 30° C., the metal plate was immersed for 60 seconds to lift the metal plate from the dispersion liquid (dip coating method). After impregnation of the sheet metal until lifting, the dispersion is continuously stirred. The lifting speed is 0.3m / min.
[0060] The metal pla...
Embodiment 2
[0063] The substrate of Example 2 was produced by the method described below.
[0064] An aqueous solution having a total concentration of acicular alumina particles (long axis 100 nm, aspect ratio 10) and silica particles (spherical particles, average particle diameter 20 nm) of 5% by mass was prepared. Acetic acid was added to this aqueous solution to adjust the pH to 4.6 to prepare a dispersion. In addition, the mass ratio of the acicular alumina particles and the silica particles was 1:9.
[0065] The same metal plate as in Example 1 was prepared. Using the same method as described in Example 1, an insulating film was formed on the surface of the metal plate. In addition, the liquid temperature of the dispersion liquid was set at 30° C., the metal plate was immersed in the dispersion liquid for 60 seconds, and the metal plate was lifted from the dispersion liquid at a lifting speed of 0.3 m / min. Thereafter, drying was performed under the same conditions as in Example 1 ...
Embodiment 3
[0068] The substrate of Example 3 was produced by the method described below.
[0069] An aqueous solution in which the total concentration of acicular alumina particles (major axis: 80 nm, aspect ratio: 7) and silica particles (spherical particles, average particle diameter: 30 nm) was 3% by mass was prepared. Acetic acid was added to this aqueous solution to adjust the pH to 4.7 to prepare a dispersion. In addition, the mass ratio of the acicular alumina particles and the silica particles was 7:3.
[0070] A metal plate (size 50 mm×50 mm×0.3 mm) formed of an alloy of Fe and Ni was prepared. The surface roughness Ra of this metal plate was 0.2 μm. Using the same method as described in Example 1, an insulating film was formed on the surface of the metal plate. In addition, the liquid temperature of the dispersion liquid was set at 30° C., the metal plate was immersed in the dispersion liquid for 60 seconds, and the metal plate was lifted from the dispersion liquid at a lift...
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Abstract
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