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Preparing heat-resistant phenolic resins

A phenolic resin and phenol technology, applied in the fields of new materials, polymer modification, material preparation, and chemical chemistry, can solve the problems of limiting high-performance friction materials, insufficient heat resistance, and high brittleness of phenolic resins.

Inactive Publication Date: 2006-04-19
李青山
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Using pure phenolic resin as a friction material, such as the base material of luxury cars, motorcycle brake pads and clutch plates, cannot meet these requirements
Traditional unmodified phenolic resins have high brittleness, poor toughness, and insufficient heat resistance, which limit the development of high-performance friction materials. At present, phenolic resins for high-performance friction materials are mainly imported from abroad.

Method used

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  • Preparing heat-resistant phenolic resins
  • Preparing heat-resistant phenolic resins

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Embodiment Construction

[0012] 1. First mix and stir 0.36g oxalic acid with a certain amount of phenol, formaldehyde, and organically modified montmorillonite, then add boric acid, stir and heat up to the reaction temperature of 100-110°C, add about 0.18g of oxalic acid after 1 hour of reaction, and continue to keep the temperature constant After reacting for 3-4 hours, raise the temperature and depressurize to extract the low-molecular matter, and finally obtain the heat-resistant phenolic product.

[0013] 2. Phenol is mixed and stirred with boric acid and organic montmorillonite to react at about 110°C, then add formaldehyde and catalyst, react at about 90°C for a certain period of time, and vacuum remove all the water, which is the heat-resistant phenolic finished product.

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Abstract

A refractory phenolic resin used for friction material, adhesive, etc is prepared by using the nano material and boron compound to modify phenolic resin. The high-temp tolerance of the friction disc made of it can reach 480 deg.C or more.

Description

technical field [0001] The invention belongs to the fields of material preparation, chemistry, new materials, polymer modification and the like. Background technique [0002] Phenolic resin raw materials are easy to obtain, low cost, good heat resistance, high mechanical strength, and stable performance. fulfil requirements. The weak link in the structure of phenolic resin is that the phenolic hydroxyl group and methylene group are easily oxidized, and the heat resistance is affected. With the continuous development of industry, especially the use conditions of various vehicles and machinery and the development of aviation, aerospace and other cutting-edge technologies for national defense, new requirements are put forward for high-performance friction materials, such as higher thermal decomposition temperature, good Excellent heat recovery performance, sufficient friction coefficient, good wear resistance and low noise, etc. Using pure phenolic resin as a friction materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/10C08L61/10C08K3/34
Inventor 李青山王新伟叶大铿
Owner 李青山
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