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Optical mask possible to reduce manufacturing cost and design method

A technology of manufacturing cost and design method, which can be used in semiconductor/solid-state device manufacturing, optics, photolithography process of pattern surface, etc., and can solve the problem of high cost of mask manufacturing

Inactive Publication Date: 2006-07-05
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a small number of diversified integrated circuit dies, this mode is not suitable for the relatively high cost of mask manufacturing required for each die.

Method used

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  • Optical mask possible to reduce manufacturing cost and design method
  • Optical mask possible to reduce manufacturing cost and design method
  • Optical mask possible to reduce manufacturing cost and design method

Examples

Experimental program
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Effect test

Embodiment Construction

[0016] When the designed critical dimension (Critical Dimension) is getting smaller and smaller, the optical proximity effect (Optical Proximity Effect) generated in the exposure process will become more and more serious. The more refined the optical proximity correction (Optical ProximityCorrection) is, the source file (GDS file) of the integrated circuit design graphics will increase dozens of times after the optical proximity correction. The time it takes for an e-beam writer to perform pattern exposure becomes quite time consuming. For example, after optical proximity correction, the time required for electron beam exposure for a 0.13-micron process photomask usually takes at least 20 hours, and more advanced electron beam lithography equipment is currently the most expensive in semiconductor-related industries Equipment, so electron beam exposure is a major bottleneck in production capacity in the photomask manufacturing process, which greatly affects the production cost ...

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Abstract

The invention is a photo mask designing method, firstly calculating number of patterns distributable in a photo mask substrate; then calculating the costs of a first photo mask and a second photo mask, separately; then calculating the whole manufacturing cost of a preset number of wafers prepared by each photo mask and selecting the one whose whole manufacturing cost is lower to design the number of patterns of the photo mask substrate. Better, the number of patterns of the first photo mask is equal to that of distributable patterns and that of the second photo mask is less than that of distributable patterns. The photo mask comprises a photo mask substrate, a first pattern arranged in a partial region on the photo mask substrate and a second pattern arranged in the other partial region, where the two patterns are appearances used for defining different layers of a crystal grain on a wafer, respectively.

Description

technical field [0001] The present invention relates to a photomask and its design method that can be used to reduce the photomask manufacturing cost in photomask development, which uses the expected required yield, design die area and die manufacturing cost to calculate the lowest total manufacturing Cost; in particular, a photomask and a design method thereof which reduce the manufacturing cost of the photomask by reducing the manufacturing area of ​​the photomask. Background technique [0002] In the manufacturing process of integrated circuits, the stepping machine is the most expensive equipment, so how to increase the production capacity of the stepping machine has always been regarded as the focus of improving the integrated circuit in the process stage. In order to effectively use the capacity of the stepper, foundries try to fill the available area of ​​the mask with patterns as much as possible to reduce the number of exposures and exposure time. [0003] Based on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/00H01L21/00G03F1/70
Inventor 资三德
Owner REMARKABLE