Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device and method processing substrate

A substrate processing device and substrate technology, applied in cleaning methods and tools, chemical instruments and methods, cleaning methods using liquids, etc., can solve the problems of metal film damage, uneven impact energy of ice particles and substrate surface, uneven treatment, etc.

Inactive Publication Date: 2010-07-28
DAINIPPON SCREEN MTG CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, problems such as uneven cleaning and uneven processing will occur.
[0004] In addition, there is such a problem: For example, in the manufacture of LCD, the metal film used for liquid crystal graphics is formed by metal materials with soft physical properties such as aluminum (Al)+molybdenum (Mo), due to the ice particles and the surface of the substrate Due to uneven impact energy, the metal film will be partially damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method processing substrate
  • Device and method processing substrate
  • Device and method processing substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[0040] figure 1 An example of an embodiment of the present invention is schematically shown, and is a perspective view of a schematic configuration of a substrate processing apparatus, in this example, a substrate cleaning apparatus.

[0041] This substrate cleaning apparatus has a cleaning tank 10 formed of a sealed rectangular housing in which the substrate W is cleaned. The planar shape of the cleaning tank 10 is a rectangular shape having a width larger than the width of the substrate W and a length smaller than the length of the substrate W in the transfer direction. In the cleaning tank 10, a substrate carrying port 12 and a substrate carrying port 14 are provided on a pair of side faces facing each other, and a cleaning solution containing ice particles, such as pure water (hereinafter, A supply port 16 and a discharge port 18 referred to as "ice slu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
clearance rateaaaaaaaaaa
clearance rateaaaaaaaaaa
Login to View More

Abstract

The present invention provides a device that is capable of preforming even processing without generating processing nonuniformity and does not damage a film formed on a substrate when processing is performed on the substrate by using process liquid containing ice particulate. The device comprises a washing tank 10 that stores the process liquid containing the ice particulate, a means that supplies the process liquid containing the ice particulate into the tank 10 and discharges the process liquid from the washing tank by allowing the process liquid to flow in the washing tank, a means that brings the substrate W in the tank 10 and conveys the substrate therein and brings the substrate out of the washing tank, and the process liquid is contacted with the principal face of the substrate while allowing the process liquid containing the ice particulate to flow relatively against the substrate W in the tank 10.

Description

technical field [0001] The present invention relates to cleaning of substrates such as semiconductor wafers, glass substrates for liquid crystal display (LCD), glass substrates for plasma displays (PDP), printed substrates, ceramic substrates, electronic device substrates, etc., using a treatment liquid containing ice particles A substrate processing method for processing, etc., and a substrate processing device for implementing the method. Background technique [0002] For example, cleaning of substrates in flat panel display (FPD) manufacturing equipment such as LCDs and PDPs is carried out through a series of steps: removal of organic contamination by UV irradiation with an excimer laser, scrubbing and cleaning using a roller brush. Removal of contaminants of 1 μm or more, removal of chemical solution after chemical solution cleaning by displacement cleaning, precision cleaning by 2-fluid cleaning, and finishing cleaning by final water cleaning. In addition, in recent ye...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B08B7/00B08B3/04F25C1/00G02F1/13H01L21/304
CPCH04N21/4104H04N21/42661H04N21/4621
Inventor 川根旬平竹市芳邦
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products